Jiangsu Huahai Chengke New Materials Co., Ltd. has successfully gone public.

On April 4, Jiangsu Huahai Chengke New Materials Co., Ltd. (hereinafter referred to as “Huahai Chengke”) was listed on the STAR Market of the Shanghai Stock Exchange, with the company’s stock code being 688535.

Founded in December 2010 in Lianyungang City, Huahai Chengke is a national-level “Little Giant” enterprise specializing in niche, specialized, and innovative products. It has now grown into a leading epoxy molding compound manufacturer in China, characterized by its large scale, comprehensive product portfolio, and sustained innovation capabilities. The company has established a complete R&D and production system in the field of semiconductor packaging materials and possesses fully independent intellectual property rights. As of the first half of 2022, Huahai Chengke’s total assets amounted to 496.05 million yuan, with operating revenue reaching 149.03 million yuan and net profit standing at 16.55 million yuan for the same period.

“Semiconductor packaging technology is like giving a ‘skin’ to chips. Although the industry itself isn’t huge in scale, its importance goes without saying,” said Han Jianglong, Chairman of Huahai Chengke, at the company’s listing ceremony. He added that Huahai Chengke’s development is a microcosm of the journey taken by many high-tech enterprises in China’s semiconductor industry—from going from “zero to one,” gradually iterating their products, and climbing the “pyramid.” Throughout this journey, both hardship and glory have gone hand in hand.

“‘Dressing’ chips is a highly technical task that can’t be mastered without years of deep immersion in a specialized, niche field,” says Han Jianglong, a technology expert who graduated with a Ph.D. in Polymer Science from the School of Chemical Engineering at Nanjing University and has spent many years working on the front lines of the industry. According to him, semiconductor packaging is a critical post-manufacturing step in semiconductor production—a process that uses specific materials and advanced technologies to position, secure, and seal chips, thereby protecting their performance and connecting the chip’s electrical contacts to the package’s external housing, thus extending the chip’s internal functions outward. Epoxy molding compounds are used in the molding stage of semiconductor packaging; this application demands high technological expertise, involves complex processes, requires extensive specialized knowledge, and features a sophisticated formulation system. Moreover, depending on differences in product type, customer-specific packaging requirements, production equipment, process controls, and end-use application scenarios, these compounds must meet varying performance specifications, making them highly customized. The level of development in this area directly influences the advancement of semiconductor packaging technology, making it a crucial supporting industry for the semiconductor sector—with extremely high barriers to entry.

After several years of accumulation, Hua Hai Cheng Ke has built an experienced R&D team covering fields such as polymer materials and their processing, organic chemistry, organic synthesis, and inorganic non-metallic materials. The company places great emphasis on the industrialization of core technologies and has developed a comprehensive product portfolio applicable to both conventional and advanced packaging. It is one of the few semiconductor packaging material manufacturers whose product lineup covers all generations of packaging technologies. The company owns independent intellectual property rights and has obtained 100 patents, including 24 invention patents, 75 utility model patents, and 1 design patent. It has been recognized as a national-level “Little Giant” enterprise specializing in niche expertise and innovation.

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