Virtue and wisdom pave the way to a bright future for the nation.

On September 19, 2022, at 9:30 a.m., as the powerful sound of a gong rang out, Yantai Debang Technology Co., Ltd. (688035)... Officially listed on the STAR Market!

Mr. Xie Haihua, Chairman of Debang Technology, Dr. Chen Tian’an, General Manager, along with government leaders at various levels and guests from all sectors, jointly attended the listing ceremony.

(Statement by Mr. Xie Haihua)

(Dr. Chen Tian'an’s Address)

Debang Technology is a national-level “Little Giant” enterprise specializing in the R&D and industrialization of high-end electronic packaging materials. The company consistently focuses on emerging industries such as integrated circuit packaging, smart terminal packaging, and new energy applications. Its products are widely used in various packaging processes and application scenarios, including wafer processing, chip-level packaging, power device packaging, board-level packaging, module packaging, and system integration packaging.

In this IPO on the STAR Market of the Shanghai Stock Exchange, Debang Technology publicly issued 355.6 million A-shares at a price of RMB 46.12 per share, raising approximately RMB 1.64 billion. The funds raised will be primarily allocated to a high-end electronic specialty materials production project, a semiconductor electronic packaging materials construction project with an annual capacity of 35 tons, and the construction of a new R&D center. This will further enhance investment in equipment, capital, and personnel for both production and R&D, thereby boosting the company’s capacity to produce high-end electronic packaging materials.

Pursue perfect quality, deliver customer value.

Debang Technology will seize the opportunity presented by its IPO, embracing the corporate mission of “pursuing perfect quality and delivering customer value.” Driven by technological innovation, we will strengthen our industrial foundation, leverage the strengths of our talented team, fulfill our social responsibilities, and strive to become a leading player in China’s semiconductor packaging materials, electronic materials, new energy materials, and other related industries—as well as a globally competitive force!

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