The “New Materials, Core Opportunities” Advanced Packaging Materials Technology Forum was successfully held in Dongguan.

On July 7, 2022, the Advanced Packaging Materials Technology Development and Innovation Forum, hosted by the Integrated Circuit Materials Industry Technology Innovation Alliance (hereinafter referred to as the “Alliance”), the Guangdong Province Semiconductor Intelligent Equipment and System Integration Innovation Center, and the Guangdong Province Greater Bay Area Integrated Circuit and System Application Research Institute, and co-organized by Guangdong Shengyi Technology Co., Ltd., was held in Songshan Lake, Dongguan.

On-site at the venue

The forum boasts an unprecedented scale, bringing together nearly 300 participants from companies and related associations in fields such as chip design, packaging and testing, substrate/substrate-like materials, advanced packaging materials, and packaging equipment. Many industry leaders and companies with notable achievements in specialized packaging material segments are taking part in the forum and delivering keynote speeches.

The first half of the forum was chaired by Shi Ying, Secretary-General of the Materials Alliance.

Dean Ye Tianchun from the Guangdong Province Greater Bay Area Integrated Circuit and System Application Research Institute delivered a welcome speech via video link at the forum. Dean Ye praised the organizers and co-organizers for making this forum possible, expressed his hope that all participating organizations would gain valuable insights from the event, and wished the forum every success.

Lin Tingyu, Chief Scientist of the Guangdong Province Semiconductor Intelligent Equipment and System Integration Innovation Center, delivered a speech. Dr. Lin introduced the establishment and development plan of the FozhiXin Innovation Consortium, as well as its innovative research in the field of microelectronic packaging. Dr. Lin welcomed the guests and expressed his hope that they would gain valuable insights from the exchange during the forum.

In his speech, Liu Shufeng, Chairman of Shengyi Technology, introduced Shengyi Technology’s philosophy that “materials determine products” and its outstanding product design and development capabilities. He stated that Shengyi Technology will continue to strive harder and play an even more important role in the research and application of foundational materials.

Dr. Zheng Jiantao, a senior expert in packaging design, presented an overview of the development trends in packaging and packaging substrates. Using two visual aids—the “Panoramic View of Packaging Materials” and the “Panoramic View of Substrate Materials”—he analyzed the current status of domestic packaging-related materials. Through several real-world case studies, he offered recommendations and highlighted key requirements from the perspective of end-users, addressing material suppliers accordingly.

Yu Bin, a senior expert in microelectronic packaging, introduced the trends in the development of communication chips and packaging. He provided detailed explanations of the performance requirements for various packaging materials, including packaging substrates, molding compounds, underfill adhesives, and PI materials. He also compared the current gap between domestically produced materials and internationally advanced standards, calling on domestic material suppliers to continue their efforts.

Chen Xianming, CEO of Yueya Semiconductor, highlighted the profound changes in the global semiconductor landscape in recent years by outlining the rapid growth of the semiconductor market and the shift in the industry’s supply chain. Currently, domestic demand in China is extremely strong, yet substrates and substrate materials are largely supplied by foreign manufacturers. Mr. Chen emphasized that packaging substrates and core raw materials are currently the weakest links in China’s semiconductor supply chain, and these areas urgently need focused development to address existing shortcomings.

Zeng Yaode, Chief Engineer of Shengyi Technology, introduced Shengyi’s packaging substrate products. Through proprietary core technologies—including resin development and modification, comprehensive quality control, and lean manufacturing—these products demonstrate superior performance and have been validated through numerous application cases across various fields. The products have been certified by multiple end customers and are now in active use.

Liu Qianfa, Director of the National Engineering Research Center for Electronic Circuit Base Materials, highlighted the technological roadmap and product structure of Shengyi Technology’s stacked film (SIF) series products for advanced packaging, as well as the numerous outstanding performance characteristics of the SIF series.

Wang Dian, Technical Director of Gateron Microelectronics Technology (Shanghai) Co., Ltd., introduced the development history of millimeter-wave radar, compared the difficulties and costs associated with different AiP module technologies, and provided an overview of millimeter-wave radar applications in various fields such as automotive surround-view systems, in-cabin monitoring, industrial settings, and smart homes.

Yu Dachuan, Chairman of Xiamen Yuntian Semiconductor Technology Co., Ltd., introduced the technological advancements in RF device system packaging, including vertical through-hole 3D packaging technology, a new type of fan-out packaging technology, and low-cost glass via technology—technologies designed to address higher-level system packaging solutions.

Cui Chengqiang, Chairman and General Manager of Guangdong Fozhi Xinwei Electronic Technology Research Co., Ltd., delivered a detailed report on the technological background, key challenges, research progress, applications, and reliability of glass substrates. He stated that glass is an excellent inner-layer material for FCBGA packaging substrates and holds tremendous potential in fields such as high-frequency chips, optoelectronics, and MEMS.

Huang Mian, General Manager of Shenzhen Zhongke Sihé Technology Co., Ltd., introduced the board-level fan-out package (FOPLP) technology. He stated that one of the key focuses of FOPLP technology is the integration of homogeneous and heterogeneous multi-chips. As the market continues to evolve, this technology will expand to heterogeneous integration at larger dimensions, and the demand for modularity will keep growing.

Su Zhi, Chairman of Guangzhou Fangbang Electronic Co., Ltd., introduced the development progress of peelable ultra-thin copper foil for packaging substrates. He proposed a solution with L/S dimensions of 25/25 μm or less, which enables peelable technology through physical means while maintaining stable peel force and crystal morphology. By controlling the transfer of customized copper foil surface topography, the SAP process can be achieved; after a copper-thinning process, the mSAP process can also be realized.

Secretary-General Shi Ying of the Materials Alliance pointed out that new opportunities in the industry and opportunities presented by new materials complement each other. The Alliance is actively playing a bridging role to promote innovative development across the industrial chain and is working hard to advocate for greater national support. Secretary-General Shi Ying expressed gratitude to Shengyi Technology for its participation in planning and organizing this grand forum, which exemplifies the spirit of collaborative innovation between upstream and downstream partners. Subsequently, Secretary-General Shi Ying presented a certificate of appreciation to Chen Renxi, President of Shengyi Technology.

After the forum, all participants went to Shengyi Technology’s Songshan Lake Factory to visit the Shengyi Technology exhibition hall, the National Engineering Center laboratory, and the flexible materials production line.