24

2022

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05

Announcement of the First Batch of Group Standards for 2021


Announcement of Group Standards

To all relevant units:

In accordance with the Provisions of the "Management Measures for Group Standards of the Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance," documents such as "Epoxy Molding Compound for Integrated Circuits" and others... 6 The group standard has been developed in accordance with the prescribed procedures and has passed the approval process. The standard name and standard number are as follows:

 

Serial number

Standard Number

Standard Name

1

T/ICMTIA PM0010-2022

Epoxy molding compound for integrated circuits

2

T/ICMTIA TG0011-2022

High-purity aluminum and aluminum alloy sputtering targets for integrated circuits

3

T/ICMTIA ESG0012-2022

Mixed gases for integrated circuits 1.25% Krypton / Neon

4

T/ICMTIA ESG0013-2022

Mixed gases for integrated circuits 3.5% Argon /10ppm Xenon / Neon

5

T/ICMTIA ESG0014-2022

Mixed gases for integrated circuits 30% Oxygen / Helium

6

T/ICMTIA ESG0015-2022

Gases for integrated circuits Deuterium

 

The above standards apply to 2022 Year 4 Moon 8 Approved for release on the day, 2022 Year 5 Moon 1 Effective as of today, this is hereby announced.

Attachment: Materials Alliance [2022] No. 018

Key words:

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