The main structural topping-out ceremony has been completed for the Zhejiang Lishui Zhongxin Wafer Epitaxy Project!

At 3:28 p.m. on May 8, 2022, the topping-out ceremony for the large-diameter silicon wafer epitaxy project of Zhejiang Lishui Zhongxin Wafer Semiconductor Technology Co., Ltd. (hereinafter referred to as “Zhejiang Lishui Zhongxin Wafer”) was held with great solemnity.

Figure: Scene of the topping-out ceremony

At the ceremony, Lou Zhijian, Member of the Standing Committee of the Lishui Municipal Party Committee and Vice Mayor, announced the topping-out of the Lishui Zhongxin Wafer’s large-diameter silicon wafer epitaxy project. Liu Zhiwei, Secretary of the Party Working Committee and Director of the Management Committee of the Lishui Economic and Technological Development Zone, and He Xianhan, Chairman of the Board of Ferrotec (China) and Chairman of Zhejiang Lishui Zhongxin Wafer Semiconductor Technology Co., Ltd., delivered speeches respectively. Chen Lei, Deputy Director of the Management Committee of the Lishui Economic and Technological Development Zone, presided over the topping-out ceremony.

The Zhejiang Lishui Zhongxin Wafer Epitaxy Project has a total investment of 4 billion yuan. The first phase will involve the construction of facilities capable of producing 1.2 million 8-inch epitaxial wafers and 2.4 million 12-inch epitaxial wafers annually. Following the groundbreaking ceremony held on November 17 last year, the Zhejiang Lishui Zhongxin Wafer Epitaxy Project swiftly moved into the foundation construction phase. Thanks to the concerted efforts of all parties involved, the project achieved topping-out of its main structural framework in just 88 working days.

Recently, the Lishui Zhongxin Wafer Epitaxy Project was officially included in Zhejiang Province’s 2022 Key Construction Project Plan. Against the backdrop of global chip shortages and a severe COVID-19 situation, the construction and development of the Lishui Zhongxin Wafer Epitaxy Project in Zhejiang present both “opportunities” and “challenges.” We believe that with the concerted efforts of all parties involved, the Lishui Zhongxin Wafer Epitaxy Project—scheduled for completion this November—will effectively meet the growing global demand for large silicon wafers in the semiconductor industry. At the same time, it will help Lishui ultimately establish a development model characterized by “major projects + industrial chains + modern clusters + a base for the future.”

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