The second-phase project of Xingyang Technology in Inner Mongolia, with an annual output of 1,200 tons of high-tech silicon-based materials for chip electronics, is expected to begin production by the end of this year.

According to a report by Northern New Report, as cited by Jiwei.com, the second-phase project of Inner Mongolia Xingyang Technology Co., Ltd., which aims to produce 1,200 tons per year of high-tech silicon-based materials for chip electronics, is currently undergoing infrastructure construction and is expected to be completed and put into operation by the end of this year.

In August 2018, the company’s Phase I project—the annual production of 3,000 tons of silicon-based new materials for electronic-grade applications—officially went into operation, and by 2021, its output value had reached 146 million yuan. The high-tech silicon-based materials produced in Phase II represent the reuse and comprehensive utilization of both intermediate and final products from the Phase I silane project.

In November 2020, the 1,200-ton-per-year high-tech silicon-based material project for chip-grade electronic applications, undertaken by Inner Mongolia Xingyang Technology Co., Ltd., was officially approved. According to information released by the People's Government of Ordos at the time, once the project comes into operation, it will address the shortcomings in China’s production of similar products, further breaking the long-term monopoly of foreign markets in the field of specialty gases for chip electronics. This project is of great significance for accelerating the development of China’s integrated circuit, flat-panel display, photovoltaic, aerospace, and defense industries.

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