Historical Review of the 2021 China Semiconductor Materials Innovation and Development Conference

This year marks the beginning of China’s 14th Five-Year Plan. We are facing a tight supply chain situation in the domestic and global semiconductor industry, yet we are also ushering in new opportunities for development.

To consolidate the strengths of China’s integrated circuit manufacturing industry across the entire value chain, bring together talents from various fields, and enhance connectivity between upstream and downstream segments of the integrated circuit materials industry chain, the Integrated Circuit Materials Innovation Alliance (hereinafter referred to as the “Materials Alliance”) and the Semiconductor Supporting Industries Branch of the China Semiconductor Industry Association, in collaboration for the first time with the Integrated Circuit Branch of the China Semiconductor Industry Association, the Integrated Circuit Equipment Innovation Alliance, the Integrated Circuit Components Innovation Alliance, the Integrated Circuit Packaging and Testing Innovation Alliance, and the China Integrated Circuit Testing and Inspection Innovation Alliance, are jointly hosting the “24th China Integrated Circuit Manufacturing Annual Conference & Supply Chain Innovation Development Conference” under the theme of “New Start, New Challenges, Vitality and Dynamism in the Chip Industry.” During this event, the Materials Alliance will also hold the “2021 China Semiconductor Materials Innovation and Development Conference.”

The 2021 China Semiconductor Materials Innovation and Development Conference will focus on current global trends in the semiconductor materials industry and the state of China’s materials industry development. It will bring together industry experts and senior corporate executives to jointly explore new priorities for breakthroughs in the materials field, emerging needs for corporate innovation and development, and new modes of collaboration among industries and regions. The conference aims to encourage all stakeholders in China’s integrated circuit materials industry to adopt a more proactive, confident, open, and inclusive mindset as they embrace new challenges and tackle emerging difficulties. In addition, the conference will also organize specialized activities such as industrial chain matchmaking and interactive sessions, as well as advanced materials workshops.

I. Conference Organizing Committee

Guiding Unit ：

Office for the Implementation and Management of the National Major Science and Technology Special Project on Ultra-Large-Scale Integrated Circuit Manufacturing Equipment and Complete Process Technologies

China Semiconductor Industry Association

China Integrated Circuit Innovation Alliance

Guangdong Provincial Department of Industry and Information Technology

Guangdong Provincial Development and Reform Commission

Guangdong Provincial Department of Science and Technology

Guangzhou Municipal Bureau of Industry and Information Technology

People's Government of Huangpu District, Guangzhou City

Guangzhou Development Zone Management Committee

Organizer:

China Integrated Circuit Materials Innovation Alliance

Semiconductor Supporting Industries Branch of the China Semiconductor Industry Association

Integrated Circuit Branch of the China Semiconductor Industry Association

China Integrated Circuit Packaging and Testing Innovation Alliance

China Integrated Circuit Equipment Innovation Alliance

China Integrated Circuit Components Innovation Alliance

China Integrated Circuit Testing and Validation Innovation Alliance

Guangdong Integrated Circuit Industry Association

Guangdong-Hong Kong-Macao Greater Bay Area Semiconductor Industry Alliance

II. Meeting Dates: November 1–3, 2021

3. Meeting Location: Guangzhou Huangpu Junlan Hotel (No. 129, Wenjian Road, Huangpu District, Guangzhou)

Schedule for the 2021 China Semiconductor Materials Innovation and Development Conference

November 1st

9:00-12:00 Registration

13:30-15:00 Alliance Members’ General Meeting and Board of Directors Meeting

15:30-17:30 ICMtia Supply-Demand Matchmaking Session (Closed Door)

November 2nd

9:00-12:00 Manufacturing Annual Summit Forum

12:00-14:00 Lunch

14:00-17:00 Manufacturing Annual Conference Summit Forum

13:30–17:30 ICMtia Supply-Demand Integrated Platform Matchmaking Meeting (Closed Door)

6:00 PM Dinner

November 3, 2021 China Semiconductor Materials Innovation and Development Conference

9:00-9:30 IC Materials Award Ceremony

Host: Shi Ying, Executive Vice Chairman and Secretary-General of ICMtia

9:30-12:00 Keynote Speech

Host:

Dr. Wang Shumin, Chairperson and General Manager of Anji Microelectronics Technology (Shanghai) Co., Ltd.

Dr. Yao Lijun, Chairman and Chief Technology Officer of Ningbo Jiangfeng Electronic Materials Co., Ltd.

9:30–9:50 Advanced Packaging and Its Material Requirements

Speaker: Dr. Zheng Ziqi, CTO of Advanced Packaging at Tongfu Microelectronics Co., Ltd.

9:50-10:10 The Era of Technological Convergence—Reshaping the Landscape of Semiconductor and Electronics Technologies

Speaker: Dr. Tianniu Chen, General Manager of the Semiconductor Division, Electronic Technology Business, Merck China

10:10–10:30 Current Status and Future Outlook of Electronic Gases for Integrated Circuits

Speaker: Dr. Junhua Li, Chairman of China Shipbuilding Industry Corporation (Handan) Perry Special Gas Co., Ltd.

10:30-10:50 The Art of CMP: Scientific Principles of Materials Engineering at the Nanoscale Interface

Speaker: Dr. Yu-chun Wang, Vice President of Anji Microelectronics Technology (Shanghai) Co., Ltd.

10:50-11:10 Progress in the Development and Industrialization of ArF Photoresist Products

Speaker: Dr. Mao Zhibiao, Deputy General Manager of Ningbo Nanda Optoelectronic Materials Co., Ltd.

11:10-11:30 Development Prospects, Challenges, and Emerging Opportunities in the Semiconductor Materials Market

Speaker: Dr. Dan P. Tracy, Senior Market Analyst at TECHCET

11:30-11:50 Current Status and Development Trends of China’s Integrated Circuit Manufacturing Materials Industry

Speaker: Shi Ying, Executive Vice Chairman and Secretary-General of ICMtia

12:00-13:00 Lunch

13:15–18:00 ICMtia Advanced Materials Workshop (Closed Door)

Gold Partner:

Bronze Partner: