Best Collaboration Award

Winning Project

Co-development for the domestic mass production of advanced packaging underfill materials

Winning Organization

Hua Jin Semiconductor Packaging Leading Technology R&D Center Co., Ltd.

Yantai Debang Technology Co., Ltd.

Jiangsu Changdian Technology Co., Ltd.

Award Introduction

As a process development and verification platform that bridges basic research and industrial applications, HuaJin Semiconductor has joined forces with Yantai Debang to conduct research on chip-level underfill encapsulation processes. From the process perspective, we have identified key encapsulation process parameters that influence warpage, gap filling, bump protection, and flow defects, ensuring optimal compatibility between encapsulation materials and encapsulation processes. Through coordinated joint research and development—focusing on both formulation and process integration—we have ultimately achieved comprehensive deliverability of electronic encapsulation materials and successfully introduced these materials into Changdian Technology’s mass-production facility, laying a solid foundation for the large-scale production and application of domestically developed underfill materials.

Winning Project

Improvement in the Quality of Domestically Produced Silicon Epitaxial Materials

Winning Organization

HuaRun Microelectronics Co., Ltd.

Nanjing Guosheng Electronics Co., Ltd.

Award Introduction

China Resources Microelectronics Co., Ltd. and Nanjing Guosheng Electronics Co., Ltd. are closely collaborating on “Improving the Quality of Domestically Produced Silicon Epitaxial Materials,” advancing together and growing jointly. They have set a successful model for cooperation in rapidly enhancing supply-chain quality and improving management practices.

Winning Project

Research and Development and Industrial Application of Domestic Mid-to-High-End Epoxy Molding Compounds for Integrated Circuits

Winning Organization

Tianshui Huatian Technology Co., Ltd.

Jiangsu Huahai Chengke New Materials Co., Ltd.

Award Introduction

Tianshui Huatian Technology Co., Ltd. and Hua Hai Chengke New Materials Co., Ltd. have jointly developed foundational technologies, including nano-scale dispersion of rubber particles, release agents, and pretreatment processes for coupling agents, successfully resolving the QFP issue. The series of integrated circuit product packaging and molding processes, along with reliability issues, have enabled the industrial-scale application of domestically produced mid- to high-end plastic encapsulants.

Winning Project

Localization of Temporary Bonding Materials for High-Density Fan-Out Packaging

Winning Organization

Shenzhen Huaxun Semiconductor Materials Co., Ltd.

Shenzhen Institute for Advanced Electronic Materials International Innovation Research Institute

Changdian Integrated Circuit (Shaoxing) Co., Ltd.

Award Introduction

Shenzhen Huaxun Semiconductor and the Shenzhen Institute of Advanced Electronic Materials Innovation, Chinese Academy of Sciences, are jointly tackling key core technologies related to temporary bonding materials. They are also collaborating with Changchuan Integrated Circuit (Shaoxing) Co., Ltd. on the development and application of material processing technologies, successfully overcoming numerous technical bottlenecks in this material process. As a result, they have developed proprietary patented technologies and achieved mass production, which are now being applied to high-density fan-out packaging for high-performance server chips.

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