Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance

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2021

The list of winners for the “2nd Integrated Circuit Materials Award” has been announced.

To encourage technological innovation among integrated circuit materials enterprises, accelerate the commercialization of innovative achievements, and strengthen collaborative development across the upstream and downstream segments of the industry chain, the Integrated Circuit Materials Industry Technology Innovation Alliance has been organizing the “Integrated Circuit Materials Awards” competition since 2020. This year marks the second edition of the competition. After voting and comprehensive evaluation by the评审 committee and the Secretariat, a total of 29 awards—including the Technical Breakthrough Award, the Best Collaboration Award, and the Best Contribution Award—were presented and recognized at the “2021 China Semiconductor Materials Innovation and Development Conference” held on November 3. The list of winners is as follows:

1. Technology Breakthrough Award

Winning Project	12 Development and Mass Production Technologies for 248nm Photoresist Products for 100mm Process Lines
Winning Organization	Beijing Kehua Microelectronics Materials Co., Ltd.
Award Introduction	Starting from raw material development and the design and optimization of formulations, the R&D team at Beijing Kehua has established a 248nm photoresist technology platform and developed a series of photoresist products. The technical specifications and application performance of these products have reached the same level as those of comparable international products. The product range covers process nodes from 0.25 microns to 14 nanometers and has been adopted on a large scale by mainstream integrated circuit manufacturing companies in China.

Winning Project	12 Research and Application of Key Technologies for Electronic-Grade Sulfuric Acid Used in Advanced Process Manufacturing of Integrated Circuits in Inches
Winning Organization	Hubei Xingfu Electronic Materials Co., Ltd.
Award Introduction	Relying on its own resource advantages, Hubei Xingfu controls the high purity of sulfur trioxide right from the source and uses a proprietary process route to produce ultra-high-purity sulfuric acid. The company has achieved automation in product quality testing, with the ability to detect more than 60 different elements. Its products are now being supplied in stable, bulk quantities to customers using 8- to 12-inch advanced manufacturing processes.

Winning Project	Hardmask Copper Damascene Process Etch Residue Remover
Winning Organization	Anji Microelectronics Technology (Shanghai) Co., Ltd.
Award Introduction	Through research and innovation into the removal mechanisms of next-generation photoresists, Anji Microelectronics has successfully developed a hard-mask copper damascene etch residue remover, achieving import substitution. The product has now entered mass production and is being applied at technology nodes ranging from 40nm to 28nm.

Winning Project	Research and Development and Industrialization of Ultra-High-Purity Hydrogen Chloride for Integrated Circuits
Winning Organization	China Shipbuilding Industry Corporation (Handan) Pairy Special Gas Co., Ltd.
Award Introduction	Perry Specialty Gases Co., Ltd. has developed a complete set of production processes and analytical methods covering gas production, filling, and analytical testing. The company has successfully produced 5N high-purity hydrogen chloride gas, with product performance indicators reaching the level of similar international products. This product has now been put into large-scale application by domestic semiconductor companies.

2. Best Collaboration Award

Winning Project

Co-development for the domestic mass production of advanced packaging underfill materials

Winning Organization

Hua Jin Semiconductor Packaging Leading Technology R&D Center Co., Ltd.

Yantai Debang Technology Co., Ltd.

Jiangsu Changdian Technology Co., Ltd.

Award Introduction

As a process development and verification platform that bridges basic research and industrial applications, HuaJin Semiconductor has joined forces with Yantai Debang to conduct research on chip-level underfill encapsulation processes. From the process perspective, we have identified key encapsulation process parameters that influence warpage, gap filling, bump protection, and flow defects, ensuring optimal compatibility between encapsulation materials and encapsulation processes. Through coordinated joint research and development—focusing on both formulation and process integration—we have ultimately achieved comprehensive deliverability of electronic encapsulation materials and successfully introduced these materials into Changchun Technology’s production facility, laying a solid foundation for the mass production and widespread application of domestically developed underfill materials.

Winning Project

Improvement in the Quality of Domestically Produced Silicon Epitaxial Materials

Winning Organization

HuaRun Microelectronics Co., Ltd.

Nanjing Guosheng Electronics Co., Ltd.

Award Introduction

China Resources Microelectronics Co., Ltd. and Nanjing Guosheng Electronics Co., Ltd. are closely collaborating on “Improving the Quality of Domestically Produced Silicon Epitaxial Materials,” advancing together and growing side by side. They have set a successful example of cooperation in rapidly enhancing supply-chain quality and improving management practices.

Winning Project

Research and Development and Industrial Application of Domestic Mid-to-High-End Epoxy Molding Compounds for Integrated Circuits

Winning Organization

Tianshui Huatian Technology Co., Ltd.

Jiangsu Huahai Chengke New Materials Co., Ltd.

Award Introduction

Tianshui Huatian Technology Co., Ltd. and Huahai Chengke New Materials Co., Ltd. have jointly developed foundational technologies, including nano-scale dispersion of rubber particles, release agents, and pretreatment processes for coupling agents. These efforts have successfully addressed the encapsulation molding process and reliability issues associated with QFP-series integrated circuit products, paving the way for the industrial application of domestically produced mid- to high-end plastic encapsulants.

Winning Project

Localization of Temporary Bonding Materials for High-Density Fan-Out Packaging

Winning Organization

Shenzhen Huaxun Semiconductor Materials Co., Ltd.

Shenzhen Institute for Advanced Electronic Materials International Innovation Research Institute

Changdian Integrated Circuit (Shaoxing) Co., Ltd.

Award Introduction

Shenzhen Huaxun Semiconductor and the Shenzhen Institute of Advanced Electronic Materials Innovation, Chinese Academy of Sciences, are jointly tackling key core technologies related to temporary bonding materials. They are also collaborating with Changchuan Integrated Circuit (Shaoxing) Co., Ltd. on the development and application of material processing technologies, successfully overcoming numerous technical bottlenecks in this material process. As a result, they have developed proprietary patented technologies and achieved mass production, which are now being applied to high-density fan-out packaging for high-performance server chips.

Winning Project

High-ration germane-hydrogen mixtures for mass production applications in advanced logic SiGe processes

Winning Organization

Bochun Materials Co., Ltd.

Shanghai HuaLi Integrated Circuit Manufacturing Co., Ltd.

Award Introduction

Shanghai HuaLi has introduced Boron-Pure high-ratio germane-hydrogen mixtures and diborane mixtures, achieving 100% domestic production of high-ratio germane-hydrogen mixtures for HuaLi’s germanium-silicon process, thereby improving production line stability and operational efficiency by 10%.

Third: Best Contribution Award

1. Li Shaoping

Li Shaoping, Chairman of Hubei Xingfu Electronic Materials Co., Ltd. and Vice Chairman of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials Industry, has spearheaded the R&D of numerous process chemicals and successfully developed a series of high-purity products, including phosphoric acid, sulfuric acid, hydrofluoric acid, and formulated functional chemicals. These products are widely used in the manufacturing of 8-inch and 12-inch integrated circuits. He also led the establishment of the Yichang Specialty Zone for Electronic Chemicals and has made outstanding contributions to the cluster-based and large-scale development of process chemicals as well as to the enhancement of the supply chain!

2. Li Shaobo

Li Shaobo, Vice Chairman of China Shipbuilding Industry Corporation (Handan) Pairy Special Gas Co., Ltd., leads the company’s team specializing in electronic specialty gases. Together, they have overcome key technical challenges—including the synthesis, purification, impurity detection, and efficient blending of high-purity fluorine-containing electronic gases—and achieved large-scale production. Performance indicators for high-purity electronic gases such as nitrogen trifluoride and tungsten hexafluoride have reached or surpassed those of comparable international products, laying a solid foundation for the future leapfrog development of the high-purity specialty gas industry.

3. Pan Jie

Pan Jie, General Manager of Ningbo Jiangfeng Electronic Materials Co., Ltd., has long been engaged in the research and development and industrialization of sputtering targets and is one of the renowned Chinese-American technical experts in this field. He has led or participated in numerous national-level scientific research and industrialization projects, holds over 400 authorized patents, including more than 270 invention patents. He has made significant contributions to Jiangfeng Electronics’ entry into globally leading semiconductor chip companies and to the domestic development of ultra-high-purity materials and sputtering targets.

4. Wang Yuchun

Wang Yuchun, Deputy General Manager of Anji Microelectronics, is one of the early pioneers in the application of chemical-mechanical polishing to advanced processes in integrated circuits. He has led the Anji Microelectronics team to successfully develop a series of polishing slurries for copper/copper barrier layers, tungsten, oxides, and silicon vias, which have been mass-produced and adopted in logic chips at the 130-14nm technology node as well as in 3D NAND and DRAM chips, achieving domestic production. At the same time, he has made outstanding contributions to the client-side applications of polishing slurries and to the improvement of the upstream and downstream industrial chain.

Four- and Five-Star Products

	Winning Project	Winning Organization
1	Electronics-grade sulfuric acid	Hubei Xingfu Electronic Materials Co., Ltd.
2	High-purity sulfuric acid for integrated circuit manufacturing	Zhongjuxin Technology Co., Ltd.
3	Electronics-grade sulfuric acid	Lianshi New Materials Co., Ltd.
4	Tungsten Polishing Liquid Series	Anji Microelectronics Technology (Shanghai) Co., Ltd.
5	300mm Ultra-high-purity copper target	Youyan Yijin New Materials Co., Ltd.
6	Advanced Packaging Photoresist Stripper Series	Anji Microelectronics Technology (Shanghai) Co., Ltd.
7	Ultra-pure, high-purity hydrogen peroxide	Jingrui Electronic Materials Co., Ltd.
8	Silicon components for integrated circuit etching	Youyan Semiconductor Silicon Materials Co., Ltd.

5. Best Growth Award

	Winning Project
1	Ningbo Jiangfeng Electronic Materials Co., Ltd.
2	Beijing Dabo Nonferrous Metal Solder Co., Ltd.
3	Zhongjuxin Technology Co., Ltd.
4	Bochun Materials Co., Ltd.
5	Chongqing Chao Silicon Semiconductor Co., Ltd.
6	Jingrui Electronic Materials Co., Ltd.
7	Yantai Debang Technology Co., Ltd.
8	Hubei Dinghui Microelectronics Materials Co., Ltd.

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