Expanding 12-inch silicon wafer production capacity—Zhongxin Wafer completes its Series B funding!

Recently, Hangzhou Zhongxin Wafer Semiconductor Co., Ltd. (hereinafter referred to as “Zhongxin Wafer”) successfully completed its Series B financing round, raising RMB 3.3 billion. The round was co-led by Zhejiang Provincial State-owned Capital and Linxin Investment, with participation from well-known institutions including CITIC Capital, Zhejiang Provincial Financial Development Company, ICBC International, SME Development Fund, Qingdao Minxin, Shanghai Guosheng Capital, Hangzhou Qiantang Industry Investment Fund, China Cinda Asset Management, CICC Pucheng, and Bank of Communications International. Existing shareholders such as Yangtze Optical Fibre and Cable, CICC Capital, Shanghai Free Trade Zone Equity Fund, and Dongzheng Capital also made additional investments. The funds raised in this round will be used to build a second production line for 12-inch silicon wafers with an initial capacity of 100,000 wafers per month. By the end of 2022, the monthly production capacity of 12-inch silicon wafers is expected to reach 200,000 wafers.

Currently, Zhongxin Wafer has a monthly production capacity of 400,000 6-inch and smaller wafers, 450,000 8-inch wafers, and 100,000 12-inch wafers. By December 2022, its 12-inch capacity will reach 200,000 wafers per month. Its products include polished wafers (heavily doped/lightly doped/copper-free) and epitaxial wafers, primarily used in logic chips, flash memory chips (3D NAND & Nor Flash), dynamic random-access memory chips (DRAM), image sensors (CIS), and display driver ICs.

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