Dinghui Microelectronics has been awarded the “Outstanding Contribution Materials Supplier” prize by the Tianjin Integrated Circuit Industry Specialized Process Innovation Alliance.

On April 16, the seminar on material development trends in the diversified growth of the integrated circuit industry in the new era, hosted by the Tianjin Integrated Circuit Industry Special Process Innovation Alliance, was held in Yixing, Jiangsu Province. Hubei Dinghui Microelectronics Materials Co., Ltd., as a member of the alliance, received the Outstanding Contribution Material Supplier Award from the alliance.

Photo: Alliance Secretary-General Wang Jingsong presents a trophy to Dinghui Microelectronics.

Photo: Mr. Mei Lili, Senior Vice President of Dinghui Microelectronics, delivers a keynote speech at the seminar.

The Tianjin Integrated Circuit Industry Specialized Process Innovation Alliance was established in 2019. Its member units are 23 high-tech enterprises whose businesses revolve around integrated circuits, and the alliance integrates innovative resources across all segments of the integrated circuit industry chain. At this seminar, members of the alliance gathered to discuss the overall layout of the integrated circuit industry chain and emerging trends in industrial development. As a member unit of the alliance, Dinghui Microelectronics was represented by Mr. Mei Lili, Senior Vice President of Dinghui Microelectronics, who delivered a keynote speech titled “Opportunities, Challenges, and Strategic Planning for Domestic Materials” at the seminar, sharing insights with industry peers.

It is reported that three awards were presented at this seminar. Among numerous member companies, Dinghui stood out and was awarded the first-ever certification as an outstanding contribution material supplier—a domestic oxide-layer polishing pad manufacturer. In 2020, Dinghui Microelectronics became the first domestic enterprise to successfully pass client-side testing and achieve mass production readiness for its domestically developed oxide-layer polishing pad materials.

This award signifies the alliance’s recognition of Dinghui. Moving forward, Dinghui will work closely with the alliance to continue making contributions to technological innovation and development in China’s integrated circuit industry.

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