The Materials Alliance Packaging Materials Docking Seminar was successfully held at Changdian Technology.

On April 13, 2021, the Packaging Materials Matchmaking Seminar, co-hosted by the Integrated Circuit Materials Industry Technology Innovation Alliance (hereinafter referred to as the “Alliance”) and Changdian Technology, was successfully held in Jiangyin City.

This seminar is dedicated to strengthening cooperation between supply and demand sides and promoting collaborative efforts on the application end. With a focus on the specialized field of packaging materials, it will address issues encountered in the mass production and application of these materials, as well as the new demands and challenges posed by advancements in cutting-edge packaging technologies. By fostering an innovative mechanism for coordinated development across the upstream and downstream sectors, the seminar aims to accelerate the localization and mass production of packaging materials.

The management team of Changdian Technology, including CEO Zheng Li, Executive Vice President Luo Hongwei, and Vice President Ren Xia, along with technical personnel from departments such as supply chain, engineering technology, and R&D, engaged in in-depth and detailed exchanges and interactions with representatives from alliance packaging material companies. A total of over 70 participants, including representatives from 21 packaging material manufacturers—such as Yantai Debang Technology Co., Ltd., Wuxi Dike Electronic Materials Co., Ltd., Jiangsu Huahai Chengke New Materials Co., Ltd., Hengsuo Huawei Electronics Co., Ltd., Tianjin Degao Chemical New Materials Co., Ltd., Beijing Dabo Nonferrous Metal Solder Co., Ltd., Ningbo Kangqiang Electronics Co., Ltd., Ningbo Shijie Electronics Co., Ltd., Ningbo Jiangfeng Electronic Materials Co., Ltd., Youyan Yijin New Materials Co., Ltd., Beijing Kehua Microelectronics Materials Co., Ltd., Suzhou Ruihong Electronic Chemicals Co., Ltd., Jiangsu Hantuo Optical Materials Co., Ltd., Anji Microelectronics Technology (Shanghai) Co., Ltd., Jiangsu Aisen Semiconductor Materials Co., Ltd., Shanghai Xinyang Semiconductor Materials Co., Ltd., Shanghai Feikai Optoelectronic Materials Co., Ltd., Suzhou Xinhao New Materials Technology Co., Ltd., Shenzhen Huaxun Semiconductor Materials Co., Ltd., Anjili Electronics Technology (Suzhou) Co., Ltd., and Guangdong Shengyi Technology Co., Ltd.—participated in this meeting and conducted group-based exchanges and discussions with Changdian Technology.

During the conference, Zheng Li, CEO of Changdian Technology, pointed out that for the integrated circuit industry to thrive, it needs an even more inclusive and open mindset—using cooperation to drive innovation and using innovation to fuel development. He emphasized that materials, as the core component of integrated circuit packaging, are of great importance to Changdian Technology. Changdian Technology places great value on diversifying its material supply chain. He believes that under the impetus of the Materials Alliance and driven by innovation from material companies, through close collaboration across the entire industry chain—from upstream to downstream—China will achieve more efficient, synergistic development, thereby propelling the entire industry forward in a healthier, more efficient, and more stable manner.

Chen Huaping, Director of the Supply Chain Department at Changdian Technology; Zhang Yuesheng, Senior Manager; and Xie Jielei, Deputy General Manager of JCAP, delivered presentations titled “Opportunities and Challenges of Domestically Produced Materials,” “A Brief Discussion on the Development of Packaging Application Materials and Exploration of Capability Cooperation,” and “The Advanced Technology Development and Material Requirements at Changdian Technology,” respectively. They provided detailed explanations on specific topics including Changdian Technology’s process flows and material conditions, validation of domestic material processes, reliability certification, material introduction procedures, and the material requirements driven by future advancements in packaging and testing technologies.

Twenty-one materials companies engaged in in-depth and enthusiastic group-based exchanges with technical personnel from various departments of Changdian Technology, discussing topics such as the current status and challenges in packaging material technology development, mass-production application scenarios, and future R&D directions. Participants expressed that this exchange seminar played a crucial role in strengthening cooperation between suppliers and customers and enhancing collaborative communication on the application side.

Shi Ying, Secretary-General of the Materials Alliance, expressed gratitude to Changdian Technology for its open and inclusive attitude, which has provided material enterprises with clear direction and motivation for moving forward. Material enterprises are eager to collaborate with responsible companies like Changdian Technology—supporting each other, advancing hand in hand, and jointly creating material varieties that boast China’s brand advantages in terms of reliable performance, stable quality, and secure supply, thereby contributing to China’s integrated circuit packaging industry.