Set a big goal? China’s planned silicon wafer production capacity has already surpassed the world’s current total production capacity.

According to a report by Jiwei.com (written by Oliver), on September 10, the China Semiconductor Materials Innovation and Development Conference officially kicked off in Beilun, Ningbo. In her speech, Dr. Fei Lu, Executive Vice President of Shanghai New East Semiconductor, pointed out that currently, 14 Chinese companies have publicly announced their entry into the 300mm silicon wafer industry, bringing the total number of such companies in China to exceed the current global count of 300mm silicon wafer manufacturers. The total monthly production capacity planned by these companies amounts to 6.92 million wafers, surpassing the world’s current total production capacity.

Fei Lu pointed out that, over the 42-year period from 1976 to 2018, global integrated circuit sales increased by a factor of 168—from US$2.9 billion to US$470.3 billion—representing a compound annual growth rate of 12.8%. Among these periods, the two phases of fastest growth were driven respectively by computers and mobile phones.

Fei Lu stated that silicon wafers still dominate the semiconductor materials landscape, and more than 90% of chips and sensors are made from semiconductor-grade monocrystalline silicon. Currently, the monthly production capacity for 300mm large silicon wafers stands at 6.5 million pieces, and as the number of fabs continues to grow, the production capacity for large silicon wafers is bound to keep expanding.

Fei Lu further pointed out that large silicon wafer production technology involves crystal pulling, slicing, grinding, polishing, and epitaxy. Although the steps seem straightforward, they require consideration of a vast number of parameters, which process engineers must keep track of every single day. The core technology of silicon wafers is a process that pushes the boundaries of what’s possible. Fei Lu noted that this challenge manifests itself primarily in four key areas: crystal growth, surface cleanliness, intra-wafer flatness, and the elimination of metals and impurities.

Regarding the current status of large silicon wafers in China, Fei Lu revealed that currently 14 Chinese companies have officially announced their entry into the 300mm large silicon wafer industry, with their total number exceeding the current global count of 300mm silicon wafer companies. These companies have planned a total monthly production capacity of 6.92 million wafers, which is higher than the world’s current total production capacity.

These companies are backed by a diverse range of investors, including large funds, state-owned capital, local government funds, and national project funding, as well as foreign investment, private enterprises, and market capital. Fei Lu pointed out that the production capacities planned by these companies are too high, and achieving them may not be as easy as it seems.

Finally, Fei Lu also introduced the current status of Shanghai Xinsheng Semiconductor. As the first domestic company to achieve mass production of large-diameter silicon wafers, Xinsheng’s current monthly production capacity has reached 100,000 wafers. The existing production facility can accommodate a monthly capacity of 300,000 wafers, and the current plant site has the potential to support a monthly capacity of up to 600,000 wafers. Furthermore, additional land for expansion could enable a monthly production capacity of up to 1 million wafers. Fei Lu stated that Xinsheng aims to make the leap from “zero” to “one” in the production of 300mm domestically produced large-diameter silicon wafers, continuously enhancing both the depth and breadth of its product offerings to meet customer needs.

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