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2019
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04
The registration system for the 2019 China Semiconductor Materials Innovation and Development Conference is now officially open.
The 2019 China Semiconductor Materials Innovation and Development Conference, hosted by the Integrated Circuit Materials Industry Technology Innovation Alliance (ICMtia) and the Supporting Industries Branch of the China Semiconductor Industry Association, will be held in Ningbo from September 10 to 11, 2019. We warmly welcome all participants to attend the conference.
Currently, all preparatory work for the conference is proceeding smoothly, and the conference registration system (http://nh.icmtia.com/index.php/nhzc.html) is now officially open. The registration deadline for this conference is August 31, 2019. Companies and individuals who wish to attend are encouraged to complete their registration as soon as possible to ensure a smooth participation in the conference.
This conference will charge a corresponding participation fee. Specific fee standards are as follows:
For ICMtia member organizations and partner organization member organizations: ¥1500 per person;
For non-Icmtia member units and partner organization member units: ¥2,200 per person by July 20; ¥2,600 per person starting July 21.
Participation fees should be paid exclusively via online bank transfer. The conference organizing committee will provide invoices for participants.
In addition, attendees can visit the conference website via the Materials Alliance’s official website—Alliance Conference—to access sections such as the conference agenda, speaker profiles, and attendee guidelines, enabling them to stay promptly informed about conference arrangements, speaker details, bank account information for fee payments, and other relevant updates.
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