The 2018 China Semiconductor Materials and Components Innovation & Development Conference was successfully held in Ningbo.

From October 29 to 31, 2018, the "2018 China Semiconductor Materials and Components Innovation Development Conference" (hereinafter referred to as the "Conference") was grandly held in Beilun District, Ningbo City. Under the guidance of the China Integrated Circuit Industry Technology Innovation Strategic Alliance, the China Semiconductor Industry Association, and the Ningbo Municipal People's Government, the Conference was organized by the Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance and the Supporting Branch of the China Semiconductor Industry Association, and co-hosted by the Beilun District People's Government of Ningbo City, the Ningbo Electronics Industry Association, and the Critical Materials Council (CMC) of the United States. Attending the event were Gong Chenghe, Executive Deputy Secretary-General of the China Semiconductor Industry Association; Wang Weiwei, Director of the Electronic Information Division of the Ministry of Industry and Information Technology; Shi Ying, expert of the Overall Group of Special Project 02 and Secretary-General of the Integrated Circuit Materials and Components Alliance; Yang Shining, General Manager of Wuhan Yangtze Memory Technologies; Liang Qun, Member of the Standing Committee of the Ningbo Municipal Party Committee and Secretary of the Beilun District Party Committee; Lei Haibo, General Manager of Shanghai HuaLi Microelectronics Co., Ltd.; Steve Johnston, Director of Global Supply Chain Management and Supplier Technology Development at Intel Corporation in the U.S.; Dr. John West, General Manager of VLSI Research Europe; Dr. Yin Zhiyao, Chairman of AMEC (Shanghai) Co., Ltd.; Dr. Nic Rossi, Head of Supply Chain Operations for the Asia-Pacific Region at Lam Research; Dr. Lin Guanyang, Global Head of R&D and Technical Services at Merck Electronic Materials; Carlos Flores Padilla, Strategic Procurement Manager at ON Semiconductor; Lita Shon-Roy, President and CEO of TECHCET; as well as numerous leaders from the Ningbo Municipal Commission of Economy and Information Technology, the Science and Technology Bureau, and the Development and Reform Commission. The Conference was chaired by Secretary-General Shi Ying, Dr. Wang Shumin, Chairwoman of Anji Microelectronics; Dr. Xu Congying, Vice President of Jiangsu Nanda Optoelectronics; Dr. Yao Lijun, Chairman of Ningbo Jiangfeng Electronics; and Dean Freeman, Director and Senior Market Analyst at TECHCET.

Conference venue

China’s semiconductor manufacturing industry is currently experiencing a period of rapid growth. As critical components of the semiconductor value chain, materials and parts play an essential role in providing the foundational support needed for industrial development. To accelerate innovation and development among local materials and parts enterprises, foster closer international cooperation, and build a local supply chain that is innovative, open, collaborative, and mutually beneficial, this year’s conference brought together nearly 400 senior executives from well-known domestic and international semiconductor materials and parts companies, integrated circuit manufacturing and packaging firms, high-end equipment manufacturers, as well as relevant experts and scholars. Twenty-eight experts and scholars delivered insightful presentations, engaging in lively discussions and exchanges on topics including the development trends of China’s semiconductor manufacturing materials and parts local supply chains, future technology and market demands, the construction and management of international and local supply chains, the impact of relevant laws and regulations on the industry, and pathways for integrating international cooperation with local adaptation.

The meeting opened on the morning of October 30. Cao Jianlin, former Deputy Minister of the Ministry of Science and Technology and Chairman of the Integrated Circuit Industry Technology Innovation Strategic Alliance, entrusted Secretary-General Shi Ying to welcome all the participating delegates and extend his best wishes for the successful convening of the conference.

Vice Secretary-General Gong Cheng delivered a speech and pointed out that, with the implementation of the National Integrated Circuit Promotion Outline and the continuous advancement of the National Integrated Circuit Investment Fund, China’s semiconductor industry chain has entered a new phase of development and achieved remarkable accomplishments. However, from the perspective of meeting market demands, there is still considerable room for improvement across the entire domestic semiconductor value chain. The new era of China’s semiconductor industry development calls for coordinated efforts and joint promotion across the entire industry chain—establishing collaborative platforms, jointly tackling key technological challenges, developing groundbreaking innovative products, and accelerating the enhancement of the industry’s core competitiveness. At the same time, it is crucial to strengthen international cooperation, create channels and opportunities for global collaboration, and recognize that the strength of any single enterprise is limited; thus, we must actively leverage the role of platforms. This conference, jointly organized by the Integrated Circuit Materials and Components Alliance, the Ningbo Electronics Industry Association, and the U.S. Critical Materials Council (CMC), represents a pioneering initiative in the field of semiconductor materials and components. It will undoubtedly play a positive role in promoting international cooperation within the industry and fostering localized, integrated, and innovative development.

Speech by Gong Chenghe, Executive Deputy Secretary-General of the China Semiconductor Industry Association

In his speech, Director Wang Weiwei pointed out that the semiconductor industry is a foundational and strategic sector for the entire manufacturing industry. Its development determines the height of emerging industries. Integrated circuit materials and components occupy a leading position in manufacturing. The Ministry of Industry and Information Technology has consistently provided strong support to the semiconductor industry, such as through initiatives like the "Strengthening the Foundation" project. He expressed hope that this sector will achieve substantial growth and progress under the active efforts of industry players, the vigorous promotion by industry associations and alliances, and the guidance of the government. At the same time, Director Wang Weiwei also suggested that industrial development must adhere to a combination of international cooperation and independent innovation, integrate material enterprises with downstream applications, and link industrial development with financial support. This approach will foster synergy among all stakeholders in the industry, enabling them to work together and create a favorable industrial ecosystem. Moreover, it will help generate exemplary cooperation models and success stories tailored specifically for the semiconductor industry within China’s open market.

  Speech by Director Wang Weiwei of the Ministry of Industry and Information Technology

On behalf of the Ningbo Beilun District Party Committee and Government, the Secretary of the Group extended congratulations on the convening of the conference and warmly introduced Beilun’s overall situation and current development status. He emphasized that Beilun will, in accordance with the municipal party committee’s strategic plans and deployments, comprehensively advance its innovation-driven development strategy for the integrated circuit industry, proactively plan for the development of new, high-end integrated circuit industries, seize the commanding heights in industrial competition and development, create new growth drivers, explore new development paths, and usher in a new chapter of industrial development for Beilun in the new era. At the same time, he expressed gratitude to the National Major Project Office 02, the Institute of Microelectronics of the Chinese Academy of Sciences, the Integrated Circuit Materials and Components Alliance, and entrepreneurs from the integrated circuit industry for their great attention and strong support toward Beilun. The local government will do its utmost to provide the highest-quality services to companies setting up operations here, and will strive to make Ningbo Beilun a fertile ground for the growth of China’s integrated circuit industry.

Secretary Liang Qun delivers a speech.

In his speech, Dr. Yang Shining described Yangtze Memory’s independently developed and successfully implemented Xtacking™ architecture, as well as the strong support the company received from domestic materials suppliers throughout the development of this new architecture. The company will adhere to the principles of honesty, diligence, and innovation in its work, comply with laws and regulations in China and around the world, and vigorously enhance its international competitiveness. He also outlined the company’s overall strategic plan and expressed his hope that the domestic supply chain would be well-prepared.

Speech by Yang Shining, General Manager of Yangtze Memory Technologies

In his keynote speech titled “Openness, Innovation, and Cooperation—Prospects for China’s Chip Manufacturing Industry and Opportunities for Localization of Materials and Components,” Lei Haibo, General Manager of Shanghai HuaLi Microelectronics Co., Ltd., analyzed China’s rapidly growing chip manufacturing industry. He advised that the Chinese semiconductor sector must maintain strategic patience: core technologies cannot be waited for, cannot be obtained through handouts, and cannot be rushed. The industry needs time to hone its skills and accumulate experience. Enterprises must stay focused, adopting a phased approach in terms of execution, technology, and material types, and achieving breakthroughs in key areas—creating a situation where we are intertwined with one another.

Lei Haibo, General Manager of HuaLi Microelectronics, delivered the keynote speech.

In his keynote speech, “Precisely Positioning China’s Supply Chain in a Data-Driven, Interconnected World,” Dr. Steve Johnston, Director of the Global Supply Chain Management and Supplier Technology Development Department at U.S.-based Intel Corporation, pointed out that the data revolution has already taken place. Intel has transformed its leadership in data centerization into a driving force for the company’s development. China’s semiconductor industry and its supply chain have become global hotspots. Dr. Johnston recommended that China’s supply chain development should focus on creating a safe working environment, achieving production costs that are competitive in the market, delivering high-quality services that meet customer expectations, providing customers with effective technological solutions, and paying close attention to environmental protection and sustainable development. He also expressed his hope to establish broad and entirely new cooperative relationships with Chinese manufacturers of equipment, materials, and components.

In his report, Dr. John West, General Manager of VLSI Research Europe, presented an overview of the global product structure of integrated circuit equipment subsystems and key components, as well as the global industrial distribution and development trends, including supply regions and end markets. He emphasized that China is a crucial application market, yet its self-sufficiency rate remains very low, with heavy reliance on imports. He predicted that China’s key components and subsystems are poised to enter a period of rapid growth.

Dr. John West, General Manager of VLSI Research Europe, delivers the keynote speech.

Dr. Yin Zhiyao, Chairman of Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd., analyzed the importance and asymmetric competitive challenges facing integrated circuit equipment and materials from multiple perspectives—including application markets and technology—using abundant and detailed data. He pointed out that the equipment and materials industry suffers from several key issues: capital investment is overwhelmingly concentrated on one end, while talent development and policy upgrades lag behind; investment in chip manufacturing is substantial, yet capital allocation to equipment and materials remains extremely limited; equity financing is abundant, yet there is a severe lack of low-interest loans and R&D funding; there is an urgent need to develop equipment that is reliable, user-friendly, and cost-effective; priority should be given to the development of critical components that are currently “choke points”; intellectual property protection must be genuinely prioritized; and a stock-option incentive system involving all employees needs to be implemented. Dr. Yin called for concerted efforts to vigorously develop the equipment and materials industry so as to effectively support the growth of the integrated circuit industry chain.

Yin Zhiyao, Chairman of Zhongwei Semiconductor, delivered a keynote speech.

In his keynote speech, “Expanding Trends in Supply Chain Design,” Dr. Nic Rossi, Head of Supply Chain Operations for the Asia-Pacific region at Lam Research Corporation, analyzed the numerous challenges facing the semiconductor equipment industry, as well as the complexity and scalability of supply chains. He also shared information about Lam Research’s supply chain investments and partnerships in China, noting that China’s supply base is an important and reliable source of manufacturing for Lam Research’s factories and spare parts. Dr. Rossi expressed the company’s intention to continue expanding its industrial investments in China.

In his keynote speech titled “Photoresists and Materials for Optimizing Lithographic Processes,” Dr. Lin Guanyang, Global Head of R&D and Technical Services at Merck Electronic Materials, introduced the development history of photoresists and the evolution of Merck’s photoresist products. He provided a detailed and in-depth explanation of the innovations and working mechanisms behind lithographic technologies, as well as the evolutionary changes in materials used for photoresists. He analyzed how material advancements can enhance the performance of photoresists and presented several cutting-edge new photoresist materials, demonstrating his profound academic expertise.

Dr. Mo Kelin Guanyang delivered the keynote speech.

In the afternoon, the following specialized reports will be delivered: Dr. Chen Tianniu, General Manager of Global Surface Treatment and Cleaning at the Taiwan Branch of U.S.-based Huisheng Advanced Technology Co., Ltd., will present “Cleanliness Processes for Wafer Fabries from the Perspective of Material Suppliers in the Semiconductor Industry”; Dr. Wang Luping, Vice President of Sunan Da Optoelectronic Materials Co., Ltd., will discuss “The Current Status and Prospects of Domestic Electronic Gases for Integrated Circuits”; Dr. Wang Shumin, Chairwoman of Anji Microelectronics (Shanghai) Co., Ltd., will speak on “The Critical Role of Chemical Mechanical Planarization Technology in the Development of the Integrated Circuit Industry”; Mr. Tian Xin, General Manager of Jiangsu Xinhua Semiconductor Materials Technology Co., Ltd., will address “Market and Practice of High-Purity Electronic-Grade Polycrystalline Silicon for Integrated Circuits”; Mr. Zhang Yingmin, General Manager of Hangzhou Kebote Filtration Equipment Co., Ltd., will share insights on “The Application and Development Trends of Nanofiltration Technology in the IC Industry”; Dr. Liu Hancheng, Senior Technical Advisor at ASM Pacific Technology, will explore “Material Challenges in Flip-Chip, Wafer-Level Chip Scale Packaging, and Fan-Out Wafer-Level Packaging”; Dr. Liang Xinfu, Senior Vice President of Changchun Technology, will discuss “The Development of IC Packaging Technologies and Industrial Chain Opportunities”; Dr. Hua Fei, Chairwoman of Ningbo Huaxin Electronic Technology Co., Ltd., will present on “Packaging Technologies for Artificial Intelligence Chips”; Dr. Chen Tian’an, Chairwoman of Yantai Debang Technology Co., Ltd., will talk about “The Development of High-Thermal-Conductivity Die Attach Pastes (DAP) and Die Attach Films (DAF)”; and Dr. Zhang Yun, Chairwoman of Suzhou Xinhao New Materials Technology Co., Ltd., will focus on “Opportunities and Challenges for Core Materials in China’s Semiconductor Chip Manufacturing Process—Electroplating Additives.”

Before the end of the afternoon session, Shi Ying, an expert from the 02 Special Project Overall Group and Secretary-General of the Alliance, delivered a concluding report titled “The Current Status and Prospects of China’s Semiconductor Materials Industry.” Using extensive and detailed data analysis, she examined the rapidly growing Chinese semiconductor materials market and the current state of the materials industry. She also forecasted industry development trends and offered a forward-looking perspective. She advised entrepreneurs to adopt a holistic view of materials industry development when planning their businesses—focusing less on chasing hot trends and more on fostering collaboration and complementary partnerships, pursuing differentiated development, and promoting healthy competition for sustained and long-term success. At the same time, she called upon China’s materials industry community to actively cultivate a supply-chain ecosystem characterized by “close cooperation, mutual support, symbiotic win-win outcomes, and collaborative development.” Grounded in independent innovation, the industry should proactively seek international cooperation and create a vibrant new landscape marked by “innovation, cooperation, openness, and shared prosperity.”