Shanghai Xinsheng’s Special Project 02, 40-28nm, has successfully passed formal acceptance.

On September 28, 2020, the Implementation and Management Office of the National Key Science and Technology Major Project “Manufacturing Equipment and Complete Process Technologies for Ultra-Large-Scale Integrated Circuits” (Major Project 02) organized an expert panel to hold a comprehensive performance evaluation meeting for Major Project 02 in Shanghai Xinsheng. The project “R&D of 300mm Silicon Wafers for 40-28nm Integrated Circuit Manufacturing,” undertaken by Shanghai Xinsheng, successfully passed its acceptance review.

The project acceptance team for this initiative consists of 15 experts, with Mr. Ma Junru, Director of the Special Consultative Committee No. 02, serving as the team leader. At the meeting, the expert panel members listened to reports on the project’s completion status, on-site testing results, and user feedback reports. They reviewed the acceptance documentation, examined the project audit reports, conducted spot checks of original vouchers and material lists, and carried out an on-site inspection. After questioning and discussion, the acceptance expert panel concluded that the special project had achieved outstanding results and decided to approve its acceptance.

By undertaking this major Project 02, Shanghai Xinsheng successfully developed a complete set of technologies for the preparation of 300mm polished wafers and epitaxial wafers. All technical indicators met the assessment requirements specified in the project contract. A high-level team of technical and management experts has been established, and the company’s independent innovation capabilities have continued to improve. Furthermore, Xinsheng has completed its intellectual property layout and successfully achieved the project’s target of building a production capacity of 150,000 wafers per year.

At the acceptance meeting, the expert panel highly praised the achievements made by Xinsheng during the project implementation. Through painstaking efforts, Xinsheng has achieved a breakthrough in the industrialization of China’s 300mm large silicon wafer industry, a milestone of great significance. Moving forward, Xinsheng must continue to maintain its position as the leading enterprise in the domestic 300mm semiconductor silicon wafer industry, always adopting a forward-looking perspective, leveraging advanced technological capabilities, and embracing an innovative spirit to adapt to the ever-changing market, thereby contributing to the development of China’s integrated circuit industry.

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