The list of winners for the “First Integrated Circuit Materials Award” has been announced.

Winning Project

Preparation Process for Ultra-High-Purity Hydrogen Fluoride for Integrated Circuits

Winning Unit

China Shipbuilding Industry Corporation (Handan) Pairy Special Gas Co., Ltd.

Award Introduction

Zhongchuan Heavy Industry (Handan) Pairy Special Gas Co., Ltd. has developed high-purity specialty gases—hydrogen fluoride and fluorine—through technological optimization and tackling challenging technical problems. The key impurity indicators in these products, such as moisture and metal content, have reached internationally advanced levels, fully meeting the requirements of cutting-edge domestic manufacturing processes. Pairy Gas is committed to taking on responsibilities and striving for excellence. Through continuous technological innovation and ongoing service upgrades, we will contribute our part to the advancement and self-reliance of China’s integrated circuit industry.

Winning Project

Research and Development and Industrialization of Key Technologies for Disilane

Winning Unit

Anhui Yagesheng Electronic New Materials Co., Ltd.

Award Introduction

Anhui Yagesheng Electronic New Materials Co., Ltd. specializes in the independent development of advanced-process thin-film deposition materials. After years of intensive technological research, the company has finally succeeded in industrializing a key silicon-source material—disilane—for advanced processes below 20 nm, bringing its technology to an internationally advanced level and filling a domestic gap. The product is now sold to world-class semiconductor companies.

Winning Project

Industrialization Technology for 12-Inch Wafer Copper Process CMP Polishing Pads

Winning Unit

Hubei Dinghui Microelectronics Materials Co., Ltd.

Award Introduction

Hubei Dinghui Microelectronics Materials Co., Ltd. has been engaged in the research and development of CMP process materials since 2012. The company has developed proprietary 12-inch wafer copper-process CMP polishing pad technology and products for integrated circuits, with product quality reaching the advanced level of similar foreign products. The company has also invested over 500 million yuan to build an industrial-scale production facility with an annual capacity of 200,000 polishing pads. These pads are now being sold on a large scale to multiple fab facilities, laying a solid foundation for the independent development of CMP polishing pad technology and the advancement of the industry.

Winning Project

Industrialization Technology for 6N-Grade Phosphine and Arsenic Hydride Special Gases for Integrated Circuits

Winning Unit

Jiangsu Nanda Optoelectronic Materials Co., Ltd.

Award Introduction

Jiangsu Nanda Optoelectronic Materials Co., Ltd. adheres to a spirit of pioneering, striving for excellence, scaling new heights, and creating great achievements. The company remains steadfastly committed to technological breakthroughs and product development in the field of high-purity electronic materials. It has successfully mastered the technologies for preparing ultra-high-purity arsine and phosphine, as well as the independent design and manufacturing technologies for safe ion implantation sources. This has filled a critical gap in China’s product offerings in this area and effectively ensured the supply of safe ion implantation sources needed for integrated circuit manufacturing in China.

Winning Project

Complete Preparation Technology for 12-Inch Ultra-High-Purity Copper Targets for Integrated Circuits

Winning Unit

Youyan Yijin New Materials Co., Ltd.

Award Introduction

Youyan Yijin New Materials Co., Ltd. has been deeply engaged in the field of high-purity metal targets for integrated circuits for over a decade. Through dedicated scientific research and independent innovation, the company has successfully mastered the complete preparation technology for 12-inch ultra-high-purity copper targets and established an industrial production line. The quality of its products and its technical processes have reached internationally advanced levels, making outstanding contributions to the independent and controllable development of key target materials for China’s integrated circuits.

Winning Project

12-inch photoresist domestic production and mass application

Winning Unit

Beijing Kehua Microelectronics Materials Co., Ltd.

SMIC Integrated Circuit Manufacturing (Beijing) Co., Ltd.

Award Introduction

Starting in December 2017, the Lithography Department of SMIC’s Beijing Fab began collaborating with Beijing Kehua to advance the practical application research of photoresists. To date, several KrF and i-line photoresists have been successfully put into mass production and are now in widespread use. Thanks to the close collaboration between the two parties, Beijing Kehua has achieved significant improvements in product development and quality management; meanwhile, the team from SMIC’s Beijing Fab Lithography Department has gained a deeper understanding of the underlying mechanisms of photoresists and has greatly enhanced its capabilities in photoresist application and anomaly analysis.

Winning Project

8-inch photoresist domestic production and mass application

Winning Unit

HuaRun Microelectronics Co., Ltd.

Award Introduction

HuaRun Microelectronics regards the revitalization of China’s microelectronics industry as its own mission. It collaborates closely with domestic material suppliers to establish strategic partnerships that benefit both supply and demand sides. By achieving greater autonomy and control over materials, HuaRun Microelectronics is driving the collective growth of the domestic supply chain, which in turn helps build a full-industry-chain business model with core competitiveness and contributes to the nation’s prosperity. From 2014 to 2019, the 8-inch production line had cumulatively purchased domestically produced raw materials worth 463 million RMB.

Winning Project

Research and Development and Mass Production Application of 128-Layer 3D-NAND Oxide Polishing Pads

Winning Unit

Hubei Dinghui Microelectronics Materials Co., Ltd.

Yangtze Memory Technologies Co., Ltd.

Award Introduction

Changjiang Storage Technologies Co., Ltd. and Hubei Dinghui Microelectronics Materials Co., Ltd. have established a deep partnership in the field of polishing pads for CMP processes. Based on actual requirements, they have identified key areas for technological breakthroughs and pinpointed critical issues to be addressed. As a result, they have developed an oxide-layer polishing pad that meets the demands of the CMP process for 128-layer 3D-NAND memory chips and have successfully launched it into mass production. Through this collaborative effort, China has enhanced its independent innovation and product development capabilities in the CMP polishing pad sector, reduced market prices for these products, and laid a solid foundation for further technological advancement.

Winning Project

Promotion of Domestic Production of SiC Substrate Materials

Winning Unit

Nanjing Guosheng Electronics Co., Ltd.

Award Introduction

Nanjing Guosheng Electronics Co., Ltd. has long been committed to the R&D and production of high-quality semiconductor epitaxial materials, boasting over 40 years of industrialization experience. In 2017, Guosheng established a team dedicated to promoting the localization of SiC (silicon carbide) substrate materials. The team conducted research on the relationship between SiC substrate material parameters and epitaxial process parameters, defined verification protocols for substrate materials, and engaged in joint technological攻关 with domestic SiC substrate suppliers. As of 2020, Guosheng had completed batch-scale verification with three domestic substrate manufacturers, and these substrates have been stably adopted by downstream chip companies, demonstrating consistent product quality. Through technological accumulation and process optimization, some domestic SiC substrate manufacturers have achieved product parameter levels that are among the world’s most advanced, and their production capacities have also significantly increased, thereby making substantial contributions to the development of China’s wide-bandgap semiconductor materials industry.

Winning Unit

Fu Zhuhong, General Manager of Guangdong Huate Gas Co., Ltd.

Award Introduction

Fu Zhuhong is the General Manager of Guangdong Huater Gas Co., Ltd., a Senior Engineer, and the Vice Chairman of the Gas Sub-Technical Committee under the National Technical Committee for Standardization of Semiconductor Equipment and Materials. He leads the company’s R&D efforts in electronic gases, with over 20 varieties of these gases being used in domestic 8-inch and 12-inch chip manufacturing plants; some of these products have even reached the 5-nanometer process technology node. The lithography gases he developed have been certified by ASML and are widely adopted by leading IC manufacturers. He has also presided over numerous national and provincial projects, including the “02 Special Project,” making significant contributions to the technological advancement and large-scale application of electronic gas products.

Winning Unit

Ren Kai, Deputy General Manager of Nanjing Guosheng Electronics Co., Ltd.

Award Introduction

Ren Kai, Deputy General Manager of Nanjing Guosheng Electronics Co., Ltd., boasts extensive experience in silicon epitaxy process technology and production management. He established and led Guosheng’s “Team for Promoting the Localization of Key Raw Materials, Auxiliary Materials, and Critical Consumables and Spare Parts for Semiconductor Silicon Epitaxy,” collaborating closely with leading enterprises across China’s related industrial chain. As a result, significant achievements have been made in localizing epitaxy equipment, critical components, and special gas systems. This not only ensures the security of the semiconductor silicon epitaxy supply chain but also drives the overall technological advancement and industrial transformation of domestic supporting enterprises, creating a win-win and multi-win situation of healthy development.

Winning Unit

SMIC, Shi Wei

Award Introduction

In the collaboration between Beijing Kehua and the Lithography Division of SMIC’s Beijing Fab, Manager Shi Wei has provided Beijing Kehua with numerous targeted recommendations in areas such as product planning, photoresist testing, and equipment stability. At the same time, he has advocated for deeper communication and cooperation between the two sides, fostering regular technical exchanges that enable lithography engineers to gain a better understanding of photoresist mechanisms and steadily enhance their confidence in locally produced photoresists. Over the past five years, multiple KrF and i-line photoresist products have been finalized and successfully scaled up for mass production, thereby making significant contributions to building local photoresist supply capabilities.

Winning Unit

Ningbo Shijie Electronics Co., Ltd.

Award Introduction

Ningbo Shijie Electronics Co., Ltd. was registered and established in February 2019 in Beilun District, Ningbo City. The company specializes in the technological research and product development of integrated circuit packaging materials. After more than a year of rapid growth, a group of high-level talents—including numerous doctoral holders from both China and abroad—have joined the company and settled in Beilun, successfully assembling an R&D and production team that integrates everything from new material design and equipment design and manufacturing to material production processes. In early April 2020, Shijie Electronics obtained ISO9001 certification. Several of its products have been validated by leading international customers, and its production equipment for semiconductor package interface thermal conductive materials has reached HVM capacity. Moreover, the company has passed the factory audit conducted by AMD’s packaging facility, and its production volume is now entering the ramp-up phase!

Winning Unit

1

Zhejiang Jinruihong Technology Co., Ltd.

2

Shennan Circuit Co., Ltd.

3

Ningbo Jiangfeng Electronic Materials Co., Ltd.

4

Zhongjuxin Technology Co., Ltd.

5

Anjie Li Electronic Technology (Suzhou) Co., Ltd.

6

Chongqing Chao Silicon Semiconductor Co., Ltd.

7

Fujian Del Technology Co., Ltd.

8

Yantai Debang Technology Co., Ltd.

Winning Project

Winning Unit

1

Nitrogen trifluoride NF3

China Shipbuilding Industry Corporation (Handan) Pairy Special Gas Co., Ltd.

2

Tungsten hexafluoride WF6

China Shipbuilding Industry Corporation (Handan) Pairy Special Gas Co., Ltd.

3

Electronics-grade phosphoric acid H3PO4

Hubei Xingfu Electronic Materials Co., Ltd.

4

300mm Aluminum (Al) Target

Ningbo Jiangfeng Electronic Materials Co., Ltd.

5

300mm Tantalum (Ta) Ring

Ningbo Jiangfeng Electronic Materials Co., Ltd.

6

300mm Copper (Cu) Anode

Ningbo Jiangfeng Electronic Materials Co., Ltd.

7

Copper Polishing Liquid Series

Anji Microelectronics Technology (Shanghai) Co., Ltd.

8

Barrier Layer Polishing Liquid Series

Anji Microelectronics Technology (Shanghai) Co., Ltd.

9

High-purity hydrofluoric acid for integrated circuit manufacturing

Zhongjuxin Technology Co., Ltd.

10

High-purity nitric acid for integrated circuit manufacturing

Zhongjuxin Technology Co., Ltd.

11

Arsine Safety Source

Jiangsu Nanda Optoelectronic Materials Co., Ltd.

12

Phosphine Safety Source

Jiangsu Nanda Optoelectronic Materials Co., Ltd.

13

Boron trifluoride safety source

Jiangsu Nanda Optoelectronic Materials Co., Ltd.

14

Electronics-grade carbon monoxide

Guangdong Huater Gas Co., Ltd.

15

Electronic-grade carbon dioxide

Guangdong Huater Gas Co., Ltd.

16

Chip Copper Interconnect Plating Solution SYS ^D 2110

Shanghai Xinyang Semiconductor Materials Co., Ltd.