CMP unit members_Mtia - Research and development of universal embodied intelligence and embodied operating system

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CMP unit members

Fan'erchen Semiconductor

2018.09.27

Tianjin Huahai Qingke Mechanical and Electrical Technology Co., Ltd.

2018.09.27

Shanghai Xin'anna Electronic Technology Co., Ltd.

2018.09.27

Hua Jin Semiconductor Packaging Leading Technology R&D Center Co., Ltd.

2018.09.27

Tianjin University of Technology

2018.09.27

Hebei University of Technology

2018.09.27

Shanghai University

2018.09.27

Southwest Jiaotong University

2018.09.27

Huaqiao University

2018.09.27

Dalian University of Technology

2018.09.27

Fudan University

2018.09.27

Shanghai Xinyang Semiconductor Materials Co., Ltd.

2018.09.27

Shanghai Jiewei Electronic Technology Co., Ltd.

2018.09.27

Shenzhen Lihe Materials Co., Ltd.

2018.09.27

Ningbo Jiangfeng Electronic Materials Co., Ltd.

2018.09.27

Anji Microelectronics (Shanghai) Co., Ltd.

2018.09.27

Beijing Multi-Dimensional Electronic Materials Technology Development and Promotion Center

2018.09.27

Institute of Microelectronics, Chinese Academy of Sciences

2018.09.27

The 45th Research Institute of China Electronics Technology Group Corporation

2018.09.27

SMIC Integrated Circuit Manufacturing (Beijing) Co., Ltd.

2018.09.26

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