The 3rd Session of the 3rd Council and the Members’ General Meeting of the Alliance were successfully held in Beijing.

2019 Year 12 Moon 27 Day, the Integrated Circuit Materials Industry Technology Innovation Alliance (hereinafter referred to as) “ Alliance ” The Members’ General Meeting and the 3rd Session of the 3rd Council were successfully held at the Beijing Jingyi Grand Hotel. Attending the meeting were Yao Lijun, the inaugural rotating Executive Chairman of the Integrated Circuit Materials Alliance; Shi Ying, the Secretary-General; members of the Council; and representatives from member units. 120 Others attended the meeting.

At the conference, the Secretariat provided a comprehensive report to the delegates on the Alliance’s 2019 work summary and its 2020 work plan. It also presented reports on several key areas, including group standardization and supplier pre-assessment efforts, the sub-forum on C-MRS microelectronics and optoelectronics, the China Semiconductor Materials Innovation and Development Conference, the proposed construction plan for a shared testing instrument platform, the selection criteria for the China IC Materials Award, and the financial revenue and expenditure situation for 2019. In 2020, the Alliance will continue to focus intensively on seven major areas: supporting the materials sector under Project 02, promoting supply-demand collaboration and accelerating mass production applications, organizing industry-academic exchange activities, fostering international technological exchanges and industrial cooperation, providing policy recommendations for industrial planning, deepening research on intellectual property rights and standardization efforts, and collecting industrial operational data as well as conducting trend analysis—thus continuing to serve its member units effectively.

The meeting focused on discussing the work plan for the alliance’s operational management mechanism. All participants unanimously approved several improved provisions, including the addition of an executive chairman who would rotate every two years, holding the board of directors’ annual meeting concurrently with the Materials Conference, and establishing a mechanism for re-evaluating the qualifications of board members at the end of each term. A consensus was reached on these improvements.

For four consecutive years, the Alliance has been collecting information on the mass production and application of domestically produced materials, providing strong support for the Alliance’s industrial research and strategic research efforts under the “02 Special Project.” To recognize the outstanding data reporters who have submitted timely, accurate, and complete data during the collection process for mass production and application of domestic materials, medals were presented to these exemplary reporters at the conference.

The conference also invited Liu Bing, General Manager of Suzhou Jingrui Chemical Co., Ltd., to deliver a compelling presentation titled “Intellectual Property Innovation and Risk Management for Integrated Circuit Materials in the New Context.”

Secretary-General Shi Ying delivered an outstanding report titled “Striving to Develop a Local Materials Supply Chain to Support the Stable Development of the Semiconductor Industry.” The report, supported by comprehensive data, covered topics such as trends in China’s integrated circuit manufacturing materials market, the current state of the industry, existing challenges facing the industry, and future development trends.

In his summary, Dr. Yao Lijun, the first Executive Chairman of the Alliance, spoke about returning to China to start a business. 15 Thank you very much at mid-year. 02 We greatly appreciate the strong support provided by specialized organizations, alliances, and user units, and we hope to make even greater contributions to both the industry and the nation. We emphasize that the alliance’s work should focus on serving the country’s development and the needs of the industry, and on serving... 02 The various specialized tasks serve to facilitate communication among the Alliance, its member alliances, and individual enterprises; strengthen the standardization of the Alliance’s daily operations and management; enhance quality improvement initiatives; and actively promote greater development of China’s integrated circuit materials industry.

The delegates attending the meeting are affiliated with the alliance. 2020 The annual work plan was hotly debated, and high expectations were placed on the rotating chairmanship mechanism for the third council. The meeting also reviewed and approved the membership applications of four companies: Ningbo Shijie Electronics Co., Ltd., Beijing HuanYu Jinghui Jingcheng Gas Technology Co., Ltd., Zhejiang Taote Container Technology Co., Ltd., and Dalian Huabang Chemical Co., Ltd.

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