The 2019 China Planarization Technology Conference and the Cross-Strait Planarization Technology Seminar, along with the Integrated Circuit Materials Industry Technology Innovation Alliance CMP Technology Workshop, were successfully held at the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences.

From May 26 to 29, 2019, the China Planarization Technology Conference and the Cross-Strait Planarization Technology Symposium were successfully held at the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences. The conference was organized by the China Planarization Technology Alliance and hosted by the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences and Hebei University of Technology, with co-organizers including the Taiwan Planarization Application Technology Association, Shanghai Xin’anna Electronic Technology Co., Ltd., and Zhejiang Xinchuanna Electronic Technology Co., Ltd. It was guided by the Integrated Circuit Materials Industry Technology Innovation Alliance and the Shanghai Nanotechnology Association. The event aimed to promote exchanges and cooperation in planarization technology across the Taiwan Strait and advance China’s planarization technology.

5 Moon 26 Date to 29 day 2019 The China Flatness Technology Conference and the Cross-Strait Flatness Technology Symposium were successfully held at the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. The conference was organized by the China Flatness Technology Alliance and co-organized by the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, and Hebei University of Technology. It was also supported by the Taiwan Flatness Application Technology Association, Shanghai Xin’anna Electronic Technology Co., Ltd., and Zhejiang Xinchuanna Electronic Technology Co., Ltd., and guided by the Integrated Circuit Materials Industry Technology Innovation Alliance and the Shanghai Nanotechnology Association. The event aimed to promote exchanges and cooperation in flatness technology across the Taiwan Strait and to advance the development of China’s flatness technology. The conference was chaired by Researcher Liu Weili from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, and Professor Liu Yuling from Hebei University of Technology, with senior experts in China’s microelectronics manufacturing field serving as advisors. Nearly... 60 Home unit 150 The conference will be attended by members including academicians of the Chinese Academy of Engineering, experts and scholars from universities, research institutes, and well-known microelectronics companies across the Taiwan Strait, as well as members of the Taiwan Flat Panel Display Association and the Integrated Circuit Materials Industry Technology Innovation Alliance.

The conference was held in the form of a plenary report and poster presentations, including: 1 One keynote report, 15 An invited report, 19 one oral presentation and 27 A wall poster. The conference theme is the latest achievements and progress in flattening technology, specifically divided into: CMP Technology development trends, CMP Process, CMP Equipment, CMP Consumables, CMP Polishing liquid research, new materials CMP Research, CMP Mechanism, hard materials CMP Compound materials CMP 、 CMP Abrasive and CMP Process and post-cleaning, total 11 This topic provides an in-depth discussion on the path that flattening has taken so far, the current state and progress of flattening technologies, and the future directions for the development of flattening technologies.

During the conference, Xu Juyan, an academician of the Chinese Academy of Engineering, delivered the keynote speech titled “Introducing a Trend Worth Paying Attention To.” The speech analyzed and discussed how the next decade will see a peak in software-hardware co-programming from two perspectives: first, the technological bottlenecks and economic downturns in various industries necessitate the development of both software and hardware programming products and technologies; second, current development trends point toward the growing importance of software-hardware co-programming products. Following that, renowned experts, scholars, and researchers from both sides of the Taiwan Strait presented rich and in-depth reports on various topics. After the presentations, the conference also saw the establishment of the Integrated Circuit Materials Industry Technology Innovation Alliance. CMP Technology workshop ，40 Professors and entrepreneurs from the flatness-oriented field sat around a table, engaging in lively and cheerful discussions focused on... CMP Several key technical issues were discussed in depth, offering valuable insights and suggestions for the industry’s development and achieving excellent communication results.

5 Moon 29 The daily meeting organized the participants to visit the Shanghai Institute of Microtechnology and Industrial Research. 8 The tour of the Cun Line was well-received.

Under the careful planning of the State Key Laboratory of Functional Materials for Information and the Department of Scientific Research, this conference—through in-depth interactions among representatives from academia and industry—has played a positive role in promoting exchanges and cooperation between both sides of the Taiwan Strait in the field of planarization technology, as well as in advancing the development of planarization technology in China!

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