26

2019

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04

Registration for the 2019 China Semiconductor Materials Innovation and Development Conference is now officially open.

The “2019 China Semiconductor Materials Innovation and Development Conference” (hereinafter referred to as the “Conference”) will be held in Ningbo, China from September 10 to 11. The Conference cordially invites you to join us.


  The “2019 China Semiconductor Materials Innovation and Development Conference” (hereinafter referred to as the “Conference”) will be held in Ningbo, China, from September 10 to 11.

 

The conference will bring together entrepreneurs and expert scholars from China and abroad in the fields of integrated circuit manufacturing, packaging and testing, and key materials. They will discuss how the domestic semiconductor materials sector can strengthen international cooperation, accelerate technological upgrades, and promote ecosystem development in the face of new challenges—including a slowdown in the global semiconductor industry, structural reshaping of the domestic industry, market iteration, and breakthroughs in technological pathways. The conference will also facilitate interactive matchmaking between upstream and downstream segments of the industrial chain, as well as in-depth exchanges between enterprises and local governments.

The conference sincerely invites you to join us.

 

Registration for the conference is now officially open.

Meeting Location: Lijun Hotel, Yingxiu City, Ningbo, No. 1288 Baoshan Road, Beilun District, Ningbo City, Zhejiang Province

Meeting dates: September 10-11, 2019

Meeting Agenda:

Monday, September 9

In the afternoon

Conference Registration

Tuesday, September 10

9:00-9:30

Opening Ceremony

9:30-12:00

Keynote Speech

12:00-13:30

Lunch

1:30 PM - 5:30 PM

Invited Report
Summary Report

6:00 PM - 8:00 PM

Supply and Demand Networking Cocktail Reception

Wednesday, September 11

8:30-12:00

Special Event
1. Supplier Coordination Meeting
2. Xin Gang Forum

12:00-13:00

Lunch

1:30 PM - 4:00 PM

Alliance Council (closed-door)

 

 

Leave the meeting

 

 

Organizer: Integrated Circuit Materials Industry Technology Innovation Alliance

China Semiconductor Industry Association Supporting Industries Branch

Co-organizer: People’s Government of Beilun District

Ningbo Electronics Industry Association

Registered address: http://nh.icmtia.com/index.php/nhzc.html

Registration deadline: August 31, 2019

Conference fee: For ICMtia member organizations and partner organization members: ¥1,500 per person;
Non-Icmtia member organizations and partner organization member organizations: ¥2,200 per person by July 20.

Starting July 21, ¥2,600 per person.

 

For details, please visit: http://nh.icmtia.com/index.php/nh.html

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