The 2nd and 3rd Councils and the Members’ General Meeting of the Alliance were successfully held in Beijing.

On January 11, 2019, the General Assembly of the Integrated Circuit Materials and Components Alliance (hereinafter referred to as the “Alliance”) was successfully held at the Beijing Convention Center. Attending the meeting were more than 150 representatives, including Qiu Gang, Deputy Inspector of the Major Projects Division of the Ministry of Science and Technology; Ye Tianchun, Chief Engineer of the 02 Special Project and Director of the Institute of Microelectronics, Chinese Academy of Sciences; Yang Deren, Academician of Zhejiang University; Zhang Xin, Chairman of the Alliance and Vice President of SMIC; Zhao Yuhang, Chairman of the Zhongguancun Materials Alliance and Chairman of the Shanghai Integrated Circuit R&D Center; Shi Ying, Secretary-General of the Alliance, and representatives from member units. The meeting reviewed and summarized the work of the second Board of Directors from 2015 to 2018, and deliberated and voted on proposals regarding the Alliance’s divestiture of its component business and the admission of new members by the Zhongguancun Materials Alliance. Concurrent with the meeting, elections were held for a new Board of Directors, followed by the first session of the third Board of Directors and the General Assembly of Members. The meeting also discussed key priorities for the third Board of Directors and the 2019 work plan.

Conference venue

On the morning of the 11th, Secretary-General Shi Ying delivered the work report for the Second Alliance Council (2015-2018). Relevant staff from the Secretariat presented reports on financial matters, C-MRS activities, group standards, and quality assessment. Lei Zhenlin, Chairman of the Shenyang Scientific Instrument Corporation of the Chinese Academy of Sciences, delivered a report on the components sector, while Liu Yuming presented the supervisory board report. The attending delegates engaged in a lively discussion on the work reports of the Second Council.

Secretary-General Shi Ying delivered the work report of the Second Council.

At the meeting, Ye Tianchun, Chief Engineer of Special Project No. 02 and Secretary-General of the Integrated Circuit Industry Technology Innovation Strategic Alliance, pointed out that among the various specialized alliances within the Integrated Circuit Industry Technology Innovation Strategic Alliance, the Materials Alliance has demonstrated outstanding performance, with active and highly effective work. The recent China-U.S. trade tensions represent both a crisis and an opportunity for the country; for the materials industry, however, they present more of an opportunity than a challenge. It is hoped that the Materials Alliance will continue to build platforms, foster a conducive atmosphere, and unite industry forces, jointly exploring innovative development ideas and strategies geared toward 2030. By seizing market opportunities, the alliance can promote the overall growth of materials enterprises, strengthen the nation’s integrated circuit materials industry as a whole, and steadily expand its market share.

Speech by Ye Tianchun, Chief Engineer of Special Project 02 and Secretary-General of the Grand Alliance

During the meeting, Qiu Gang, Deputy Inspector of the Major Special Projects Division of the Ministry of Science and Technology and Deputy Director of the Implementation and Management Office for Special Project 02, pointed out that by 2035, the Materials Alliance should develop rapidly as a specialized, independent sector with a high-level perspective and broad vision. It should continuously innovate its working methods, enhance interaction with the special projects, and better leverage international resources to carry out international cooperation amid major shifts in the global landscape. The alliance should also closely support industrial layout and fully leverage its unique strengths in promoting the integration of technological innovation with market mechanisms. Director Qiu further stated that the Major Special Projects Division and the Office for Special Project 02 will continue to provide unwavering support to the alliance’s work, aiming to help the materials industry soon see the emergence of large, strong, and internationally competitive enterprises. To further promote the development of the materials sector, Director Qiu suggested separating the component parts business from the alliance and developing it independently. This proposal was unanimously endorsed by the attending representatives, who agreed that it would help the component parts industry quickly establish a solid foundation.

Speech by Qiu Gang, Deputy Inspector of the Department of Major Special Projects, Ministry of Science and Technology

Yang Deren, an academician at Zhejiang University and Deputy Director of the Alliance’s Expert Advisory Committee, stated that under the leadership of the Alliance, they will further refine and improve the mechanisms, and as experts from the overall group of the 02 Special Project, they will make their utmost efforts and contributions to China’s integrated circuit materials industry.

Academician Yang Deren’s Speech

In the afternoon of the 11th, the third session of the board of directors held its election for a new term. The attending delegates actively participated and cast their solemn votes. Ultimately, 54 members were elected to the third-term board of directors. Among them, Zhang Xin from SMIC International Integrated Circuit Manufacturing Co., Ltd. was elected as the chairman of the third-term board; Wang Shumin from Anji Microelectronics (Shanghai) Co., Ltd., Wang Su from Shanghai Xinyang Semiconductor Materials Co., Ltd., Wang Wei from Suzhou Jingfang Semiconductor Technology Co., Ltd., Chen Gang from Zhongjuxin Technology Co., Ltd., Li Shaoping from Hubei Xingfu Electronic Materials Co., Ltd., Li Wei from Shanghai Silicon Industry Investment Co., Ltd., Li Shaobo from China Shipbuilding Industry Corporation No. 718 Institute, Li Qi from Shanghai HuaHong Hongli Electronics Co., Ltd., Zhang Guohu from Youyan Semiconductor Materials Co., Ltd., and Yao Lijun from Ningbo Jiangfeng Electronic Materials Co., Ltd. were elected as vice chairpersons. Additionally, eight individuals were appointed as executive directors: Feng Jiansong from Jiangsu Nanda Optoelectronic Materials Co., Ltd., Liu Xianbing from Jiangsu Kema Materials Technology Co., Ltd., Yang Zhicheng from Shenzhen Nan Circuit Co., Ltd., Chen Tian’an from Yantai Debang Technology Co., Ltd., Chen Xin from Beijing Kehua Microelectronics Materials Co., Ltd., Zheng Kangding from Ningbo Kangqiang Electronics Co., Ltd., Feng Qili from Jiangsu Zhongpeng New Materials Co., Ltd., and Yin Fuhua from Jiangyin Jianghua Microelectronics Materials Co., Ltd. Shi Ying was re-elected as the executive vice-chairman and secretary-general of the alliance.

Voting session

Vote counting phase

The conference also voted to approve the amended articles of association, revised fee standards, and the explanatory notes for the third revision of the Memorandum of Agreement submitted by the Zhongguancun Materials Alliance. The list of the Expert Advisory Committee was discussed and announced. Four new member companies—Xiamen Hengkun New Materials Technology Co., Ltd., Liaoning Tuobang Hongji Semiconductor Materials Co., Ltd., Jiangsu Pacific Quartz Co., Ltd., and the Fifth Research Institute of the Ministry of Industry and Information Technology—were reviewed and approved for membership. The list of component enterprises that have been spun off from the Alliance was also read out.

After the completion of the election process, Secretary-General Shi Ying delivered a report on the key priorities of the third Council and the 2019 work plan. She outlined that the 2019 priorities would focus on seven key areas: supporting the work of the Special Project 02’s materials sector; promoting supply-demand collaboration to accelerate mass production and application; organizing industry-academic exchange activities; fostering international technological exchanges and industrial cooperation; providing policy recommendations for industrial planning; deepening research on intellectual property rights and standardization efforts; and collecting industry operational data and analyzing emerging trends. She also emphasized that special attention would be given to systematically addressing issues such as enhancing the industrial competitiveness of materials and jointly developing new material technologies.

In his summary, Zhang Xin, the third chairman of the alliance, noted that thanks to the alliance’s vigorous development over the past few years, it has already established a strong foundation. In the future, the alliance will play an even greater role in the systematic engineering of integrated circuit industry development, serving its member organizations. With a forward-looking vision, the alliance will set ambitious goals, fully leverage industry resources, achieve more effective results, and live up to the responsibilities entrusted to it by the times.

Speech by Zhang Xin, Chairman of the Alliance

In his summary, Zhao Yuhang, Chairman of the Zhongguancun Alliance, highlighted the alliance’s rich and effective work. Looking ahead, the alliance will further strengthen unity among upstream and downstream enterprises, promote collaborative development, introduce practical solutions to address real-world challenges, and drive the healthy and rapid growth of the integrated circuit materials industry.

Zhao Yuhang, Chairman of the Zhongguancun Materials Alliance, attended the meeting.

The delegates engaged in a lively discussion on the Alliance’s next phase of work and expressed high expectations for the third Board of Directors.