The Inauguration Ceremony for the Materials Alliance Advanced Packaging Materials Application Verification Platform Was Held.

On December 9, the “Materials Alliance Advanced Packaging Materials Application Verification Platform,” built by the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (referred to as the “Materials Alliance”) and依托华进 Semiconductor Packaging Leading Technology R&D Center Co., Ltd. (referred to as “HuaJin Company”), held a unveiling ceremony at HuaJin Company. Electronic materials are the foundation of packaging technology and industrial development, yet the domestic materials industry has fallen significantly behind market demand—a situation that is extremely serious. One key reason for this lag is the lack of an advanced, fully functional, and industry-recognized platform for verifying the application of packaging materials. On the other hand, electronic packaging materials are highly process-specific and application-oriented.

　　On December 9, the "Materials Alliance Advanced Packaging Materials Application Verification Platform," built by the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (referred to as the "Materials Alliance") and based on the Huajin Semiconductor Packaging Leading Technology R&D Center Co., Ltd. (referred to as "Huajin Company"), held its unveiling ceremony at Huajin Company.

　　Electronic materials are the foundation of both packaging technology and industrial development; however, the domestic materials industry is lagging far behind market demand—a situation that has become extremely serious. One key reason for this gap is the lack of an advanced, fully functional, and industry-reputable platform for validating the application of packaging materials. On the other hand, electronic packaging materials are highly process-specific products—especially electronic chemicals and polymer materials—where the materials must be developed in tandem with the corresponding application processes. Only by providing comprehensive, integrated solutions can these materials gain acceptance among users and become the preferred choice for packaging manufacturers. Yet, given the current state of China’s material enterprises—many of which are small in scale and lack the capability to independently build such process-development platforms—there is a pressing need for a public platform to serve packaging-material companies and drive industry development.

　　With the help of this platform, encapsulation material companies can conduct material evaluations tailored to actual industrialization needs, ultimately achieving comprehensive material solutions. This expands the user base and facilitates the rapid introduction of new products into both domestic and international markets. In terms of new product development, leveraging Hua Jin’s technological expertise, companies can stay abreast of emerging technology trends and create advanced encapsulation material products that better meet market demands.

　　Secretary-General Shi Ying, on behalf of the Materials Alliance, put forward three recommendations for the future work of the “Advanced Packaging Materials Application Verification Platform”: further enhance the industry’s credibility of the platform; promptly establish a tripartite cooperation model involving materials companies, the HuaJin Application Platform, and packaging manufacturers; and at the same time, organize more technical seminars to introduce trends in packaging technology, emerging material development trends, foster a vibrant industry atmosphere, and strengthen communication and collaboration between upstream and downstream sectors, thereby promoting industrial development.

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