The 2015 Cross-Strait Flatness Technology Forum was held at Tsinghua University.

From May 28 to 29, the 2015 Planarization Technology Conference and the Cross-Strait Planarization Technology Forum were successfully held at Tsinghua University. Under the guidance of the China Semiconductor Industry Association, the Specialized Committee on Micro- and Nano-Manufacturing Tribology, and the Strategic Alliance for Technological Innovation in Integrated Circuit Materials Industry, the conference was organized by the China Planarization Technology Alliance and hosted by Tsinghua University. More than 100 experts, scholars, and graduate students from both domestic and international fields related to planarization technology attended the forum. Among the attendees were Academician You Zheng, Assistant President of Tsinghua University and Dean of the School of Mechanical Engineering; Li Ming, Executive Deputy Director of the Department of Engineering and Materials Science at the National Natural Science Foundation of China; and representatives from the China Semiconductor Industry Association.

5 Moon 28 To 29 Day, 2015 The Annual Flat-Panel Technology Conference and the Cross-Strait Flat-Panel Technology Forum were successfully held at Tsinghua University. Under the guidance of the China Semiconductor Industry Association, the Specialized Committee on Micro- and Nano-Manufacturing Tribology, and the Strategic Alliance for Technological Innovation in Integrated Circuit Materials Industry, the conference was organized by the China Flat-Panel Technology Alliance and hosted by Tsinghua University. More than 100 experts, scholars, and graduate students from both domestic and international flat-panel technology-related fields attended the forum. Among the attendees were Academician You Zheng, Assistant to the President of Tsinghua University and Dean of the School of Mechanical Engineering; Li Ming, Executive Deputy Director of the Department of Engineering and Materials Science at the National Natural Science Foundation of China; Xu Xiaotian, Executive Vice Chairman and Secretary-General of the China Semiconductor Industry Association; and Academician Luo Jianbin, Director of the Department of Mechanical Engineering at Tsinghua University and Vice President of the International Society of Tribology. Shi Ying, Secretary-General of the Materials Alliance, also attended the forum. The meeting was chaired by Professor Lu Xinchun, Chairman of the Flat-Panel Technology Alliance.

In today’s rapidly advancing integrated circuit manufacturing technology, as feature sizes continue to shrink, the degree of wafer surface planarization will directly affect the control of subsequent processes. Consequently, wafer planarization has become an indispensable and critical technology in integrated circuit manufacturing. As technology nodes keep shrinking, the number of planarization steps required for both metals and dielectrics is increasing, and the demands for uniformity are becoming ever higher. CMP Technology is increasingly highlighting its importance.

At the two-day technology forum, representatives from universities and research institutions—including Tsinghua University, National Taiwan University of Science and Technology, the Institute of Microelectronics of the Chinese Academy of Sciences, and Anji Microelectronics—participated. ( Shanghai ) Limited Liability Company, Tianjin Huahai Qingke Mechanical and Electrical Technology Co., Ltd. and other equipment and consumables companies, as well as SMIC (Semiconductor Manufacturing International Corporation) ( Beijing ) Experts and scholars from integrated circuit manufacturing companies, including Limited Liability Company and Wuhan Xinxin Integrated Circuit Manufacturing Co., Ltd., gathered to discuss... CMP Technology and Applications, CMP Process and post-cleaning, CMP Consumables, CMP Mechanism and Simulation and CMP Delivered a brilliant presentation on cutting-edge technologies and related issues, and also... 20 Several participants engaged in poster presentations and exchanges.

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