The 3rd Session of the 2nd Council of the Materials Alliance was held in Wuhan.

On January 27, 2016, the second session of the third council meeting of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Materials Alliance”) was held in Wuhan. The council summarized the Materials Alliance’s work in 2015 and discussed and planned its activities for 2016. The meeting was chaired by Secretary-General Shi Ying. Chen Peide, Deputy General Manager, and Li Ping, Deputy General Manager, from Wuhan Xinxin were invited to attend the council meeting. More than 60 representatives from the alliance’s member units also attended the meeting. The council fully recognized the Materials Alliance’s achievements in 2015 in promoting supply-demand cooperation within the industry, facilitating collaboration among member units and industry integration, organizing industrial and academic exchange activities, and supporting the “02 Special Project.”

　　The Board of Directors fully recognized the remarkable achievements made by the Materials Alliance in 2015, including promoting industry supply-demand cooperation, facilitating collaboration among member units and industrial integration, organizing industry and academic exchange activities, supporting government and industry initiatives such as the “02 Special Project,” completing the collection and analysis of industry operational data for 2014, and strengthening the Alliance’s own institutional development. In 2016, the Materials Alliance will focus its efforts on advancing supply-demand cooperation across the industrial chain, promoting mergers and acquisitions and industrial integration in key sectors, enhancing international cooperation, establishing an intellectual property early-warning and analysis mechanism, fostering talent development, and organizing a series of events including the 2016 International Conference on Advanced Electronic Packaging Materials (APM), the China-Japan Electronic Materials Enterprises Exchange, the China Integrated Circuit Materials Conference, the 2016 International Conference on Planarization Technology (ICPT), and the preparation of the Microelectronics and Optoelectronics Division of the China Materials Congress (C-MRS). Meanwhile, Zhongguancun Science & Technology Leasing Co., Ltd., a member of the Alliance, provided an introduction to its semiconductor equipment financial leasing business. The meeting reviewed and approved applications from five entities—Kunshan Aisen Semiconductor Materials Co., Ltd., Jiangxi Deyi Semiconductor Technology Co., Ltd., Shanghai Qianghua Industrial Co., Ltd., Hubei Jingxing Technology Co., Ltd., and Tianjin DeGao Chemical New Materials Co., Ltd.—to join the Alliance. Attendees engaged in lively discussions on the Alliance’s work and put forward a variety of ideas and suggestions, such as proposing the establishment of an Alliance fund, using the Alliance’s image to promote products externally, strengthening cooperation with international material counterparts in Japan, North America, and other regions, accelerating the construction of smart factories by material enterprises, aligning with national and local policies, and bolstering talent development.

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