The Materials Alliance Successfully Hosted the Symposium on the 13th Five-Year Development Strategy for the Integrated Circuit Materials Industry.

On February 27, the Materials Alliance successfully held a symposium in Beijing on the “13th Five-Year Plan” development strategy for the integrated circuit materials industry. Attending the symposium were Miao Zhimin, Deputy Director of the Raw Materials Department of the Ministry of Industry and Information Technology; relevant professional leaders from the Electronic Information Department; Shi Ying, Secretary-General of the Materials Alliance; and heads of specialized working groups involved in the Materials Alliance’s roadmap initiative. Over the past two years, the Materials Alliance has conducted relatively systematic research on the development roadmap for the integrated circuit materials industry and the 13th Five-Year Plan, and has submitted proposals on industrial development and key projects to the “02 Special Project” as well as to the China Semiconductor Industry Association. The purpose of this symposium is to further deepen the understanding between national ministries and commissions.

　　Over the past two years, the Materials Alliance has conducted a relatively systematic study on the development roadmap for integrated circuit materials and the 13th Five-Year Plan, and has submitted recommendations on industrial development and key projects to the “02 Special Project” as well as to the China Semiconductor Industry Association. This symposium aims to further deepen the understanding among specialized leading departments of national ministries and commissions regarding the current status and development trends in the materials sector, and to gain a deeper insight into the needs of enterprises. At the same time, it will help materials companies grasp relevant national policies and development plans, ensuring that industry development aspirations align with national strategies and enabling them to receive timely support from national programs and policy measures. This will facilitate better resolution of challenges facing the industry and accelerate its development.

　　Secretary-General Shi Ying first presented a report on the current status and development forecast of China’s integrated circuit materials industry. The leaders of the specialized subgroups under the roadmap—covering areas such as polishing materials, electronic gases, process chemicals, masks, target materials, advanced packaging materials, and large-diameter silicon wafers—each delivered reports on their respective fields’ current progress, development plans, existing challenges, and proposed measures. After hearing these reports, relevant officials from the Raw Materials Department and the Electronics Department of the Ministry of Industry and Information Technology conveyed the task arrangements, fund establishment, and industrial promotion strategies for the new materials and integrated circuit industries during the 13th Five-Year Plan period. For instance, they emphasized strengthening the construction of a collaborative innovation system for new materials; strategically positioning cutting-edge new materials; establishing an insurance subsidy mechanism to accelerate the initial market development of manufacturing enterprises; coordinating with the China Securities Regulatory Commission to facilitate enterprise IPOs; and promoting the verification of new material products starting from the downstream end of the value chain.

　　Finally, Deputy Director Miao Zhimin pointed out that the state regards the new materials industry as a key area for support and has already established a collaborative mechanism involving various ministries and commissions. Moreover, the integrated circuit materials industry—a crucial component of the new materials sector—is being designated as a priority area for fostering industrialization and informatization. At the same time, he urged material enterprises to pay close attention to and actively cooperate with the government’s upcoming flagship initiatives: establishing a first-batch risk compensation mechanism; setting up production and application platforms; providing policy guidance to support leading industries and cultivate dominant enterprises; ensuring smooth information channels to promptly stay informed about government funding programs; and promptly reporting to the Ministry of Finance any adjustments to the tariff schedule.

　　This symposium received unanimous praise from the participating guests. Leaders expressed their hope to strengthen cooperation with the Materials Alliance in the future and accelerate the implementation of national policies. Business leaders also noted that the symposium had facilitated smoother communication channels with national government departments, enabling them to gain a deeper understanding of the nation’s strategic planning for advancing the integrated circuit materials industry and its leading enterprises. They expressed their wish to see more such exchange activities organized in the future.

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