The first joint promotion meeting for 200mm silicon wafers was held in Shanghai.

To accelerate the technological upgrade of China’s domestic 200mm silicon wafer industry, entrusted by the Overall Group of Project 02, the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance has established the “Working Group for Promoting Mass Production and Application of Domestic 200mm Silicon Wafers.” The Working Group’s mission is to coordinate and integrate the progress of silicon material projects under Project 02 and the procurement of silicon wafers for mass production applications in 200mm integrated circuit materials, thereby ensuring that the set goals are achieved. On May 13, 2015, the Working Group held its “First Coordination Meeting for 200mm Silicon Wafers” at HuaHong Hongli Semiconductor Manufacturing Co., Ltd. in Shanghai. Ye Tianchun, Head of the Overall Group of Project 02 and Director of the Institute of Microelectronics, Chinese Academy of Sciences, attended the meeting.

To accelerate the advancement of domestically produced... 200mm The technological upgrade of the silicon wafer industry is affected by... 02 Commissioned by the Special Overall Group, Integrated Circuit Materials Industry Technology Innovation Strategic Alliance Preparation Forming of “Made in China” 200mm Silicon Wafer Mass Production Application Promotion Working Group. The working group’s mission is to coordinate and integrate efforts. 02 Specialized silicon material projects and 200mm Progress in the procurement of silicon wafers for mass production applications of integrated circuit materials—ensure. Achieve the goal 。

2015 Year 5 Moon 13 day Working Group The “...” was held at Shanghai HuaHong Macro Semiconductor Manufacturing Co., Ltd. 200mm Silicon Wafer Collaborative Promotion First Meeting. 02 Ye Tianchun, Head of the Specialized Overall Group and Director of the Institute of Microelectronics, Chinese Academy of Sciences ，02 Academician Wang Xi, Deputy Head of the Specialized Overall Group and Director of the Institute of Microsystem, Chinese Academy of Sciences Attend the meeting and deliver a speech; 02 Specialized responsibility experts Zhang Wei, Xiao Shengan, and Jiang Juncheng attended the meeting and provided technical guidance. Shi Ying, Secretary-General of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance, chaired the meeting. The companies attending the meeting included HuaHong Macro, CR Microelectronics, SMIC, Zhejiang Jinruihong, Youyan Semiconductor, Shanghai Xin'ao, Nanjing Guosheng, Hebei Puxing, and Tianjin Huanou.

At the meeting, various integrated circuit manufacturing companies and silicon wafer manufacturers reported on their respective... Since In 02 The progress of tasks within the special project was reviewed, and the difficulties currently encountered in project implementation were identified. 02 After listening to reports from various units, Ye Tianchun, head of the special overall group, stated: “Quality control of the products is the key to project implementation. Only on the premise of ensuring quality can manufacturers confidently encourage customers to adopt domestically produced silicon wafers. I recommend that the Materials Alliance take the lead in organizing a special seminar.”

Through group discussions involving various silicon wafer manufacturers and manufacturing enterprises, At the meeting Forming of The stage’s work objectives and progress milestones have been defined, and the working mechanism for the task force has been established. 02 Academician Wang Xi, Deputy Head of the Special Overall Group, delivered a concluding speech at this meeting. And Conveyed the State Council leaders’ views on the country. Technology Regarding the acceptance work for this major special project, we hope that all the companies present here will collaborate closely and successfully complete it. 02 Specialized silicon material project and 200mm Task of the mass-production application project for integrated circuit materials. At the same time, he also hopes that the alliance can encourage various material manufacturers to fully leverage the platform provided by the nation’s “Big Fund” for integrated circuits, thereby advancing China’s efforts toward domesticating integrated circuit production. Grow bigger and stronger 。

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