NDRC: Key Implementation Priorities and Work Requirements for the Annual Major Project Packages in Emerging Industries (Cultivation of High-Tech Service Industries, Integrated Circuit Projects)

(Source: Application for Fiscal Funds from the NDRC) High-Tech Service Industry Cultivation Project (I) Project Priorities 1. Innovative Design Services: Support relevant enterprises in breaking through key common technologies such as information-based design, process-integrated design, and design of complex processes and systems. With a focus on green design, intelligent design, personalized customization, and design tools, accelerate the development of innovative design platforms and enhance the innovative design capabilities of key industries including equipment manufacturing, automotive, home appliances, information and communication, and energy. 2. Development of New Business Models in Inspection and Testing Services: Support the building of inspection and testing capacities and technological innovation, and foster new business models based on market demand.

　　(Source: NDRC, Application for Fiscal Funds)

　　High-Tech Service Industry Cultivation Project

　　(1) Project Highlights

　　1. Innovative design services.

　　Support relevant enterprises in breaking through key common technologies such as information-based design, process-integrated design, and the design of complex processes and systems. With a focus on green design, intelligent design, personalized customization, and design tools, accelerate the development of innovative design platforms and enhance the innovation-design capabilities of key industries including equipment manufacturing, automotive, home appliances, information and communication, and energy.

　　2. Development of new business models in inspection and testing services. Support the building of inspection and testing capabilities and technological innovation, carry out demonstration projects for new business models tailored to market demands, and achieve breakthroughs in areas such as standards innovation, certification and accreditation, and brand development.

　　(2) Relevant Requirements

　　1. This project will be organized continuously for three years. In 2015, we plan to give priority support to 3–5 high-tech service industry bases, and the scope of support will be gradually expanded year by year thereafter. Each high-tech service industry base is requested to develop an implementation plan for the project, focusing on the key areas mentioned above. The implementation plan should primarily include the following components: an analysis of the current status of the supported fields, strategic thinking for the next three years in these fields, development goals, supporting measures, and proposed key projects to be prioritized (in principle, no more than 15 projects).

　　2. Please submit the project implementation plan to our commission by August 31, 2015.

　　High-Performance Integrated Circuit Engineering

　　(1) Project Highlights

　　1. Construction of an advanced process production line for integrated circuits.

　　Support the research and development and industrialization of advanced process technologies for high-performance integrated circuits with 12-inch, 32/28nm and smaller nodes, establish large-scale mass production capabilities, continuously enrich and improve the process library, and enhance the overall manufacturing capacity of production lines. Support the construction of 12-inch production lines for high-performance, low-power, and high-capacity dynamic random-access memory (DRAM) and non-volatile NAND flash memory.

　　2. Integrated Circuit Specialty Process Transformation and Upgrade Project.

　　Support the construction of 8-inch specialty process production lines for microelectromechanical systems (MEMS), automotive electronics, SOI CMOS, high-voltage power devices, and other applications, thereby driving the development of supporting key equipment and materials. Also support the research and development and industrialization of third-generation semiconductor manufacturing processes, including GaAs, GaN, and SiC.

　　3. Integrated circuit design.

　　Focusing on key integrated circuit core chip areas such as mobile smart terminals, communication networks and terminal devices, high-performance processors, computers, digital multimedia, information security, the Internet of Things, cloud computing, big data, and Beidou navigation, we will support around 10 leading integrated circuit design enterprises in enhancing their innovation capabilities.

　　(2) Relevant Requirements

　　1. Based on the development status of the integrated circuit industry and in alignment with the investment priorities of the National Integrated Circuit Industry Investment Fund, we propose adopting a top-down organizational approach for the construction of advanced-process integrated circuit production lines and integrated circuit design, providing targeted support to key projects. Specifically, the funding support for production-line construction will take the form of subsidized loans; please calculate the annual loan interest based on the actual amount of fixed-asset loans incurred for each project. For integrated circuit design, we will prioritize enterprises with annual sales revenues exceeding 100 million U.S. dollars. Such enterprises are required to prepare three-year implementation plans that clearly outline targets for sales revenue, profit, R&D investment ratio, and the number of patent applications. Specific requirements will be announced separately.

　　2. Regarding the Special Process Improvement and Upgrade Project for Integrated Circuits, local competent authorities that meet the necessary conditions should, in accordance with the project’s key requirements, organize eligible entities to prepare funding application reports and submit the application materials to our Commission by August 30, 2015.

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