The 2017 Roadmap Working Group Meeting for the Integrated Circuit Polishing Materials Industry was successfully held in Beijing.

On May 16, 2017, the 2017 Integrated Circuit Polishing Materials Industry Roadmap Working Group Meeting, organized by the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry (hereinafter referred to as the “Alliance”), was successfully held in Beijing. The meeting was attended by more than ten representatives from the Roadmap Working Group, including Shi Ying, Secretary-General of the Alliance; Luo Kai from Anji Microelectronics (Shanghai) Co., Ltd.; and representatives from Shanghai Xin’anna Electronic Technology Co., Ltd., Ningbo Jiangfeng Electronic Materials Co., Ltd., Hubei Dinglong Chemical Co., Ltd., Shenzhen Songyang Microelectronics Technology Co., Ltd., Chengdu Shidai Lifu Technology Co., Ltd., and Hebei University of Technology.

　　On May 16, 2017, the 2017 Integrated Circuit Polishing Materials Industry Roadmap Working Group Meeting, organized by the Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Alliance”), was successfully held in Beijing.

　　The meeting was attended by more than ten representatives from the Roadmap Working Group, including Shi Ying, Secretary-General of the Alliance; Luo Kai from Anji Microelectronics (Shanghai) Co., Ltd.; and representatives from Shanghai Xin’anna Electronic Technology Co., Ltd., Ningbo Jiangfeng Electronic Materials Co., Ltd., Hubei Dinglong Chemical Co., Ltd., Shenzhen Songyang Microelectronics Technology Co., Ltd., Chengdu Shidai Lifu Technology Co., Ltd., Hebei University of Technology, and other organizations. The attendees discussed a range of issues related to the technological development, product portfolio, market expansion, talent planning, and challenges facing CMP polishing materials over the next five to ten years. During the meeting, the participants also explored the patent analysis framework for CMP materials being developed by the Alliance Secretariat.

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　　Shi Ying, Secretary-General of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry, chaired the meeting and delivered a speech.

　　Lu Kai, head of the Roadmap Working Group, introduced the preliminary achievements of the roadmap.

　　Conference venue

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