The 8th meeting of the 2nd Council of the Materials and Components Alliance was successfully held in Beijing.

　　Council on-site

　　Secretary-General Shi Ying delivered the alliance’s work report.

　　On the afternoon of January 19, 2018, the 2018 Members’ General Meeting and the 8th Session of the Second Council of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry (hereinafter referred to as the “Alliance”) were successfully held in Beijing. More than 200 people attended the meeting, including the Alliance’s Secretary-General, Vice-Chairpersons, Executive Directors, representatives from member units, and representatives from newly applying organizations seeking membership.

　　Secretary-General Shi Ying chaired the meeting and delivered a report on the Alliance’s 2017 work summary as well as its key strategic directions for 2018. The conference fully recognized the progress and achievements made by the Alliance in 2017, including supporting the work of the “02 Special Project” in the materials and components sector, organizing industry and academic exchange activities, continuously promoting enterprise quality improvement initiatives, conducting intellectual property research, collecting data and analyzing industry trends, officially launching group standardization efforts, further expanding media operations and maintenance, and successfully completing the registration and approval process for the association. In 2018, the Alliance will continue to advance toward new heights in its business endeavors, focusing on seven key areas: providing policy recommendations for industrial planning, facilitating international technological exchanges and industrial cooperation, promoting supply-demand collaboration to accelerate mass production and application, and organizing industry-academic exchange activities.

　　Speech by Zhang Xin, the newly appointed Chairman of the Alliance

　　The meeting reviewed and unanimously approved the election of Zhang Xin, General Manager of SMIC Northern Integrated Circuit Manufacturing Co., Ltd., as the new Chairman of the Alliance, and the addition of Wang Wei, Chairman and General Manager of Suzhou Jingfang Semiconductor Technology Co., Ltd., as a new member of the Alliance’s Board of Directors. During the meeting, newly appointed Chairman Zhang Xin pointed out that SMIC, as the largest and most technologically advanced wafer manufacturer in China, has both the responsibility and the obligation—given the industry’s robust growth momentum—to take the lead in promoting the localization of materials and equipment. Although this path is not an easy one, as a benchmark enterprise in China, SMIC’s active commitment to advancing the localization of materials can achieve twice the result with half the effort in driving the development of the domestic materials and component supply chain. He also encouraged other domestic integrated circuit manufacturers to join forces and work together toward the goal of localizing materials and equipment. In this era of rapid industrial growth, injecting fresh vitality into the supply chain is precisely the right approach for current development.

　　Representatives from companies including SMIC, Shanghai Huali Microelectronics, Wuhan Xinxin, Suzhou Jingfang, and Huatian Technology (Kunshan) respectively presented on the “02 Special Project” initiatives for the development and quality optimization of domestically produced materials and components for 12-inch integrated circuit processes, as well as on the mass-production application projects for domestically developed mid-range process high-end packaging equipment and materials. From the perspectives of various user organizations, they provided introductions and interpretations on the objectives and implementation plans for these mass-production application projects, the challenges encountered during project advancement, the progress already achieved, and the requirements placed on material and component suppliers.

　　The meeting also reviewed and voted to approve the membership applications of 14 companies, including Suzhou Jingfang Semiconductor Technology Co., Ltd., Shanghai Silicon Industry Investment Co., Ltd., Beijing Dabo Nonferrous Metal Solder Co., Ltd., Fujian Bocun Materials Co., Ltd., Hengsuo Huawei Electronics Co., Ltd., Hangzhou Glinda Electronic Materials Co., Ltd., Suzhou Guansheng Technology Co., Ltd., Fujian Jinggong Semiconductor Co., Ltd., Anhui Yagesheng Electronic New Materials Co., Ltd., Henan Hanya Microelectronics Materials Co., Ltd., China Energy Conservation Wanrun Co., Ltd., Luoyang Zhonggu Silicon High-Tech Co., Ltd., Changzhou Yuyu Optoelectronic Devices Co., Ltd., and Shenzhen Yuantai Feng Optoelectronics Co., Ltd.

　　Representatives from the Beijing Branch of Pacific Insurance introduced to the alliance’s member units the Comprehensive Insurance Program for the First Batch of New Material Applications, covering aspects such as policy background, product solutions, and insurance practices. At the same time, the first General Assembly of the Zhongguancun Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance was held.