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2018
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03
The Symposium on Collaborative Innovation Achievements in the Integrated Circuit Industry Chain and the 2018 Conference of the Integrated Circuit Industry Technology Innovation Strategic Alliance were held in Beijing.
The “Integrated Circuit Industry Chain Collaborative Innovation Achievement Exchange Conference,” organized by the Integrated Circuit Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Alliance”), was held in Beijing on March 1, 2018. More than 200 representatives from enterprises across all segments of the domestic integrated circuit industry—including internet companies, system integrators, end-device application providers, and companies spanning the entire integrated circuit value chain—as well as representatives from several universities and research institutes, attended the conference. The conference aimed to further strengthen close collaboration between upstream and downstream players in the integrated circuit industry chain, exchange innovative achievements in the integrated circuit field under major national science and technology programs, promote collaborative innovation in industrial technologies, and jointly explore new opportunities and challenges facing China’s integrated circuit industry in the new era and under new circumstances.
The “Semiconductor Industry Chain Collaborative Innovation Achievement Exchange Conference,” organized by the Integrated Circuit Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Alliance”), was held in Beijing on March 1, 2018. More than 200 representatives from enterprises across the entire integrated circuit industry chain—including those engaged in internet services, system integration, terminal applications, and various links in the value chain—as well as from several universities and research institutes, attended the conference. The conference aimed to further strengthen close cooperation between upstream and downstream sectors of the integrated circuit industry chain, exchange innovative achievements in the field of integrated circuits under major national science and technology programs, promote collaborative innovation in industrial technologies, and jointly explore new ideas and initiatives for the development of technological innovation in China’s integrated circuit industry under new circumstances and in a new era. Attendees included Cao Jianlin, Chairman of the Alliance; Ma Junru, Director of the Alliance’s Expert Advisory Committee; Hao Yue, Deputy Director of the Alliance’s Expert Advisory Committee; Ye Tianchun, Vice Chairman and Secretary-General of the Alliance; Tan Xiaosheng, Wang Xinchao, Shi Mingda, Xiao Shengli, and Yin Zhiyao, Vice Chairmen of the Alliance. Also attending the conference were specially invited guests including Chen Chuanhong, Director of the Major Projects Office of the Ministry of Science and Technology; Wu Shengwu, Deputy Director of the Electronic Information Department of the Ministry of Industry and Information Technology; Jiang Guangzhi, Deputy Inspector of the Beijing Municipal Commission of Economy and Information Technology and Director of the Implementation Management Office of Project 02; and Qiu Gang, Deputy Inspector of the Major Projects Office of the Ministry of Science and Technology and Deputy Director of the Implementation Management Office of Project 02.
In his speech, Director Chen Chuanhong of the Major Projects Office of the Ministry of Science and Technology pointed out that the Alliance, guided by national strategies, has established an excellent platform for communication and collaboration among leading enterprises, research institutions, universities, and other stakeholders from industry, academia, research, and application. This platform has fostered close coordination across the upstream and downstream segments of the industrial chain and has enabled extensive, meticulous efforts aimed at enhancing the core competitiveness of the industry. Currently, the Ministry of Science and Technology, the National Development and Reform Commission, and the Ministry of Finance have jointly initiated strategic research on the follow-up development plans for the “Nuclear High-Tech Base,” integrated circuit equipment, and broadband mobile communications after 2020. The Alliance has also selected key supporting organizations to provide services for the strategic research on these special projects. We hope that the Alliance and all its member units will take the spirit of the 19th National Congress of the Communist Party of China as their guiding principle, deeply grasp the rich implications of Xi Jinping Thought on Socialism with Chinese Characteristics for a New Era, and continue to play a vital role in technological innovation and the subsequent implementation of major special projects in China’s integrated circuit industry. He put forward four recommendations for the Alliance’s work: First, further leverage the Alliance’s leading role in perfecting the integrated circuit industrial chain and building a robust ecosystem; continue exploring implementation mechanisms that are driven by national strategies and supported by diversified social investments, and use market mechanisms to provide crucial support for overcoming difficulties and ensuring the achievement of the 2020 targets in major special projects related to the electronic information sector. Second, do a good job in providing support and services for the strategic research on the follow-up development of major special projects, fully mobilizing everyone to contribute ideas and suggestions from a national strategic perspective and offering wisdom for the development of the industry and technology toward 2035. Third, as an important vehicle for industrial technological innovation, the Alliance should further enhance its innovation capabilities and core competitiveness through its own practical efforts, and explore implementation mechanisms that facilitate deep integration among industry, academia, research, and application. Fourth, based on a systematic summary of past experiences, we should further liberate our thinking and delve deeper into exploring mechanisms that ensure the effective operation and sustainable development of the Alliance going forward.

Speech by Director Chen Chuanhong of the Major Projects Office of the Ministry of Science and Technology
Director Jiang Guangzhi, Deputy Inspector of the Special Implementation Management Office and the Beijing Municipal Commission of Economy and Information Technology, also expressed full recognition of the Alliance’s achievements over the past year in promoting collaborative innovation across the integrated circuit industry chain. He expressed hope that in its future work, the Alliance will further serve as an “information provider” for the promotion and application of domestically produced equipment and materials, a “researcher” bridging innovative outcomes with regional economic development, and a “surveyor” deeply integrating technological innovation in the information sector. The Alliance should fully leverage its role as a bridge and link, continuously strengthen enterprise cooperation, constantly create new prospects for collaborative innovation and win-win cooperation across the industry chain, and provide robust support for the sustained and innovative development of the integrated circuit industry.

Speech by Committee Member Jiang Guangzhi of the Beijing Municipal Commission of Economy and Information Technology
Ye Tianchun, Vice Chairman and Secretary-General of the Alliance and Chief Technical Advisor for National Key Science and Technology Project No. 02, delivered a report titled “From Substitution to Innovation to Leadership—Strategic Considerations for the Sustained Development of China’s Integrated Circuit Industry.” The report provided an in-depth analysis of the current state of China’s integrated circuit industry and highlighted the remarkable achievements made since the implementation of Project No. 02 in areas such as integrated circuit processes, packaging and testing, key equipment, critical materials, and components. Looking ahead at the future demands of the national economy for electronic information products, the report analyzed new trends in integrated circuit technology and industrial development, and proposed several strategic considerations for the sustained development of China’s integrated circuit industry.

Ye Tianchun, Vice Chairman and Secretary-General of the Alliance and Chief Technical Advisor for National Project 02, delivered a keynote report.
In line with the overall requirements for follow-up development strategy research on major national initiatives such as the Core High-Tech Project and integrated circuit equipment, participating leading domestic enterprises in the integrated circuit industry engaged in a lively discussion on the future trends of integrated circuit technology and markets over the next 10 to 15 years, the core technologies that need to be prioritized for breakthroughs, and new organizational mechanisms for fostering technological innovation in China’s integrated circuit industry under the current circumstances.
During the conference, the inaugural “Integrated Circuit Industry Technology Innovation Strategic Alliance Innovation Awards” were presented. A total of 35 teams and individuals from various sectors—including integrated circuit design, manufacturing, packaging and testing, equipment, materials, and components—received awards in four categories: the Technology Innovation Award, the Achievement Industrialization Award, the Industrial Chain Cooperation Award, and the Outstanding Contribution Award for Industrial Innovation, totaling 30 awards. The “Integrated Circuit Industry Technology Innovation Strategic Alliance Innovation Awards” aim to encourage innovation, guide and strengthen industrial chain collaboration, accelerate the industrialization of innovative achievements, and foster a positive environment for collaborative development across the entire integrated circuit industry chain. Yang Chonghe, Chairman of Lanqi Technology (Shanghai) Co., Ltd.; Zhao Haijun, CEO of SMIC; Liu Hongjun, Deputy General Manager of Suzhou Jingfang Technology Co., Ltd.; Yin Zhiyao, Chairman of AMEC (Shanghai) Co., Ltd.; and Wang Shumin, Chairwoman of Anji Microelectronics Technology Co., Ltd.—each representing leading enterprises from different segments of the integrated circuit industry chain—including design, manufacturing, packaging and testing, equipment, and materials—shared their respective experiences in areas such as technological innovation, achievement industrialization, industrial chain cooperation, and enterprise entrepreneurship and development.

Alliance Innovation Awards Ceremony
The conference concluded with a closing summary delivered by Ma Junru, Director of the Alliance’s Expert Advisory Committee and Head of the Supervision and Evaluation Expert Panel for the National Key Science and Technology Major Project in the field of Electronic Information. Looking back on the role played by the “02 Project” in narrowing the gap between China’s integrated circuit industry and the world’s advanced technological levels, transforming the industrial ecosystem, fostering collaborative innovation across the entire industrial chain, driving the development of related industries, and attracting and cultivating talent, Mr. Ma suggested that the Strategic Research Working Group should thoroughly summarize both the successes achieved and the challenges encountered since the implementation of the major project. The group should conduct in-depth research and hold extensive discussions from the perspectives of meeting China’s economic development and social needs for integrated circuit products and enhancing the international competitiveness of China’s integrated circuit industry across the entire value chain, thereby laying a solid foundation for strategic research aimed at ensuring the continued development of the major integrated circuit project in the new era. Outstanding enterprises from various segments of the materials and other industrial chains shared their experiences in areas such as technological innovation in the industry, commercialization of research findings, industrial chain collaboration, and enterprise startup and development.
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