The inaugural Innovation Award of the Integrated Circuit Industry Technology Innovation Strategic Alliance was announced in Beijing.

　　To encourage technological innovation in the integrated circuit industry, guide and strengthen collaboration across the industrial chain, promote industry-academia-research cooperation, accelerate the commercialization of innovative achievements, and foster a favorable environment for collaborative development across the entire industry chain, the Integrated Circuit Industry Technology Innovation Strategic Alliance has established the “Integrated Circuit Industry Technology Innovation Strategic Alliance Innovation Award,” abbreviated as the “Innovation Award.” The Innovation Award comprises four categories: First, the Technological Innovation Award, which recognizes organizations and teams that have achieved significant breakthroughs in major technological innovations and the development of critical technologies; second, the Achievement Commercialization Award, which honors organizations and teams that have demonstrated outstanding performance in advancing the commercialization of innovative results and expanding market reach; third, the Industrial Chain Collaboration Award, which acknowledges organizations and teams that have made remarkable contributions to promoting cooperation among upstream and downstream sectors of the integrated circuit industry chain as well as industry-academia-research collaboration; and fourth, the Outstanding Contribution to Industrial Innovation Award, which recognizes individuals who have made exceptional contributions in technological innovation, achievement commercialization, and industrial chain collaboration. The Alliance’s Innovation Award is reviewed annually, with a maximum of 30 awards granted each time. The first batch of 30 Innovation Awards is listed below:

　　I. Technology Innovation Award (10 awards)

　　1. Hangzhou Zhongtian Microsystem Co., Ltd., CPU R&D Team

　　Domestic CK802 Series Processor for Security Applications

　　2. Shenzhen Ziguang Tongchuang Electronics Co., Ltd., FPGA Software and Hardware Design Team

　　Million-Gate-Level FPGA Device with Independent Intellectual Property Rights (PGT180H) and Its Supporting Development Tools (PDS)

　　3. Shengke Network (Suzhou) Co., Ltd., R&D Project Team

　　SDN High-Density 10-Gigabit Ethernet Switch Chip GoldGate (CTC8096)

　　4. Shanghai HuaLi Microelectronics Co., Ltd., Technology Development Team

　　“55-nanometer SONOS embedded flash memory technology”

　　5. Yangtze Memory Technologies Co., Ltd. and the Institute of Microelectronics, Chinese Academy of Sciences—Joint R&D Team for New Three-Dimensional Memory

　　“64Gb 32-layer 3D memory integration process and chip design technology”

　　6. HuaTian Technology (Kunshan) Co., Ltd., R&D Team for Wafer-Level Silicon-Based Fan-Out Packaging Technology

　　Silicon-based Fan-Out Packaging Technology

　　7. Beijing Northern Huachuang Microelectronics Equipment Co., Ltd., AlPad PVD R&D Team

　　12-inch aluminum magnetron sputtering equipment

　　8. Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd., Media Etching Equipment R&D Team

　　7nm Dielectric Etching Equipment

　　9. Anji Microelectronics Technology (Shanghai) Co., Ltd., Technical Team for 28-nanometer Polishing Liquid Products

　　Chemical-Mechanical Polishing Slurry for Copper and Copper Barrier Layers in 28nm Integrated Circuits

　　10. Tsinghua University, Beijing Huazhuo Precision Technology Co., Ltd., and the Innovative Team for Lithography Stage Systems

　　“Dual-stage lithography machine technology”

　　II. Award for Industrialization of Achievements (10 awards)

　　1. Shenzhen Goodix Technology Co., Ltd., Biometric Product Development Team

　　“World’s First Glass-Covered Fingerprint Chip GF5126MA”

　　2. Lanqi Technology (Shanghai) Co., Ltd., Chip Design and Industrialization Team

　　Low-Power DDR Series Memory Buffer Controller

　　3. Shenzhen ZTE Microelectronics Technology Co., Ltd., Multi-mode Intermediate Frequency Chip R&D Team

　　Multi-mode digital intermediate-frequency chip

　　4. SMIC Integrated Circuit Manufacturing Co., Ltd. (Beijing, Shanghai) – 40nm Low-Power Process Mass Production Team

　　40nm low-power process

　　5. Suzhou Jingfang Semiconductor Technology Co., Ltd., Wafer-Level Chip-Scale Packaging Project Team for 12-inch Wafers

　　“12-Inch Silicon Through-Silicon Via Process: Mass Production Application Project for Key Equipment and Materials in Domestic Integrated Circuit Manufacturing”

　　6. Jiangyin Changdian Advanced Packaging Co., Ltd., R&D and Management Team for Wafer-Level Packaging Technology

　　Wafer-Level Packaging Technology for Wafer Bumps and Redistribution Layers

　　7. Shengmei Semiconductor Equipment Co., Ltd., SAPS Megasonic Single-Chip Cleaning Technology R&D Team

　　"Zhaosheng Wave Single-Chip Cleaner"

　　8. Ningbo Jiangfeng Electronic Materials Co., Ltd., R&D Team for Targets and Key Components for Electronic Thin Films

　　Ultra-high-purity metal sputtering targets for 130-28nm wiring

　　9. The 718th Research Institute of China Shipbuilding Industry Corporation, the Paire High-Purity Electronic Gas R&D and Industrialization Team

　　High-purity electronic gases: nitrogen trifluoride and tungsten hexafluoride

　　10. Chinese Academy of Sciences Shenyang Scientific Instruments Co., Ltd., Vacuum Dry Pump Team

　　Dry vacuum pump

　　III. Industry Chain Cooperation Award (5 awards)

　　1. Chinese Academy of Sciences EDA Center, Common Technology Innovation and Industry Service Team for IC Design

　　Common Technology Innovation and Platform-Based Product Services for the Advanced Integrated Circuit Design Industry

　　2. HiSilicon Semiconductor Co., Ltd., Domestic Process Implementation and Mass Production Team for 40-28nm Technologies

　　“Mass production and wafer input for domestically produced 40-28nm processes”

　　3. SMIC Integrated Circuit Manufacturing Co., Ltd., Domesticization Team for the Industrial Chain

　　Verification and Application of Domestic Equipment and Materials for 65-28nm Processes

　　4. Shanghai HuaHong Macro Semiconductor Manufacturing Co., Ltd., Domestication Project Promotion Team

　　Mass Production and Application of Domestically Produced Integrated Circuit Materials

　　5. Jiangsu Changdian Technology Co., Ltd., Tianshui Huatian Electronic Group, Tongfu Microelectronics Co., Ltd., and Shenzhen Nan Circuit Co., Ltd. jointly manage the verification team.

　　“Application of Packaging and Testing Equipment and Materials for Communication and Multimedia Chips”

　　IV. Award for Outstanding Contributions to Industrial Innovation (5 recipients)

　　1. Yang Chonghe, Chairman of Lanqi Technology (Shanghai) Co., Ltd.

　　2. Zhao Haijun, CEO of SMIC – Semiconductor Manufacturing International Corporation

　　3. Lai Zhiming, President of Jiangsu Changdian Technology Co., Ltd.

　　4. Yin Zhiyao, Chairman of Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd.

　　5. Yao Lijun, Chairman of Ningbo Jiangfeng Electronic Materials Co., Ltd.