03

2018

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03

The First Award for Outstanding Contributions to Industrial Innovation of the Integrated Circuit Industry Technology Innovation Strategic Alliance was announced in Beijing.

Talent is the key to driving technological innovation and development in the integrated circuit industry. In recent years, a notable feature of the collective breakthroughs achieved across China’s entire integrated circuit industry—spanning design, manufacturing, packaging and testing, as well as critical equipment and materials—is the emergence of a group of outstanding talents who are deeply committed to the industry and fully assume their responsibilities. Among them, leading talents have played an especially prominent role. Recently, the five recipients of the “Outstanding Contribution Award for Industrial Innovation,” announced by the inaugural Innovation Awards of the Integrated Circuit Industry Technology Innovation Strategic Alliance, represent the very best of these pioneers. Yang Chonghe, Chairman of Ralink Technology (Shanghai) Co., Ltd., led his team in independently developing the DDR series of memory buffer controllers.


  Talent is the key to driving technological innovation and development in the integrated circuit industry. In recent years, a notable feature of the collective breakthroughs achieved across China’s entire integrated circuit industry—covering design, manufacturing, packaging and testing, as well as critical equipment and materials—is the emergence of a group of outstanding talents who are deeply committed to the industry and fully assume their responsibilities. Among these talents, leading figures have played an especially prominent role. Recently, the five recipients of the “Outstanding Contribution to Industrial Innovation Award,” announced by the inaugural Innovation Awards of the Integrated Circuit Industry Technology Innovation Strategic Alliance, are among the most distinguished among them.

  Led by Chairman Yang Chonghe of Lanqi Technology (Shanghai) Co., Ltd., the company’s team has independently developed DDR-series memory buffer controller chips that have achieved breakthroughs in a series of key technologies, bringing the overall technology to an internationally leading level. These chips have now been integrated into the global high-end server ecosystem. To date, the cumulative sales revenue from this chip series has reached several billion yuan. Among them, the latest DDR4 memory buffer controller chip holds approximately 50% of the global market share. In January 2016, Dr. Yang Chonghe led Lanqi Technology in launching a collaborative effort with Intel and Tsinghua University to jointly develop the Jintai® server CPU platform, thereby making significant contributions to achieving secure and controllable domestic server CPUs.

  Dr. Zhao Haijun is the Co-CEO of SMIC. For many years, Dr. Zhao has consistently championed innovation and reform, leading the company through a rapid transition—from the completion of R&D to stable mass production—of products spanning multiple process technology nodes from 65nm to 28nm. While ensuring the company’s sustained high-speed growth over the years, he has also provided strong support for the rapid development of China’s domestic integrated circuit design industry. Dr. Zhao is also deeply committed to fostering coordinated development across the entire integrated circuit industry chain, making significant contributions to the rapid advancement of China’s IC industry ecosystem.

  Mr. Lai Zhiming, President of Jiangsu Changdian Technology Co., Ltd., has consistently upheld technological innovation over the years and successfully transformed two key technologies—“copper pillar bump technology” and “wafer-level chip-scale packaging”—into marketable products. Today, the scale of packaged products based on these two technologies ranks first in China and among the world’s leading positions. He has actively promoted the localization of advanced packaging and testing equipment, with the proportion of domestically produced equipment used in production lines exceeding 50%. In particular, nearly thirty stepper lithography machines have been procured, achieving 100% domestic production. At the same time, a verification platform for domestically produced high-end packaging and testing equipment and materials has been established, and the share of domestically sourced materials has reached 20%. For more than 20 years, Mr. Lai Zhiming has remained at the forefront of the packaging and testing industry in mainland China, making outstanding contributions in areas such as technological innovation, commercialization of research results, and the localization of equipment and materials.

  Since returning to China and starting his own business 14 years ago, Yin Zhiyao, Chairman of AMEC (Shanghai) Co., Ltd., has led his team—as Chairman of AMEC Semiconductor—as a champion of independent innovation and international competitiveness. Under his leadership, the company has successfully developed a series of plasma etching equipment that boasts world-class advanced technology and has gained recognition in international markets, with these products now being used in 7-nanometer production lines. Meanwhile, the company’s MOCVD equipment for manufacturing blue-light LEDs has also achieved a breakthrough in the market. Dr. Yin Zhiyao places great importance on intellectual property protection, and his company has maintained a strong advantage throughout more than a decade of patent battles. He is also deeply committed to the development of the entire integrated circuit industry, actively offering advice and suggestions to relevant authorities, thereby playing a crucial role in driving the industry’s growth.

  During his journey of returning to China to start a business, Yao Lijun, Chairman of Ningbo Jiangfeng Electronic Materials Co., Ltd., has vigorously introduced high-level overseas talent and focused on cultivating local talent, thereby building an internationally-minded team that meets the demands of the industry. Under his leadership, the Jiangfeng Electronics team has continuously tackled tough challenges and overcome critical technological bottlenecks, mastering core technologies in the purification of ultra-high-purity metal materials and the preparation of sputtering targets. In collaboration with equipment manufacturers, the company has spearheaded the design and manufacture of a series of domestically produced specialized equipment for target material production, developed processes with independent intellectual property rights, and established a complete production line. Furthermore, Jiangfeng Electronics has set up an integrated production and operational system covering both the purification of ultra-high-purity metal materials and the manufacturing of high-end target materials. The company has steadily expanded the scale of its target material production and made every effort to advance market development. As a result, its range of target materials has successfully entered mainstream integrated circuit manufacturers both domestically and internationally, yielding significant economic benefits.

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