Professor Wang Zhengping, known as the “Father of Modern Semiconductor Packaging,” Elected as a Foreign Academician of the Chinese Academy of Engineering

On December 19, 2013, the Chinese Academy of Sciences and the Chinese Academy of Engineering announced the list of newly elected academicians. Professor Wang Zhengping was elected as a foreign academician of the Chinese Academy of Engineering. Professor Wang Zhengping is a Chair Professor of Electronic Engineering at the Chinese University of Hong Kong, Dean of the Faculty of Engineering, a member of the U.S. National Academy of Engineering, and a foreign academician of the Chinese Academy of Engineering. He has long been engaged in research on electronic packaging. For his pioneering contributions to this field over several decades, he was awarded by IEEE the IEEE Component, Packaging, and Manufacturing Technology Award—the highest honor in the field of electronic packaging—and is widely recognized in the industry as the “Father of Modern Semiconductor Packaging.” Professor Wang is a pioneer in plastic encapsulation technology.

2013 Year 12 Moon 19 On [date], the Chinese Academy of Sciences and the Chinese Academy of Engineering announced the list of newly elected academicians, and Professor Wang Zhengping was elected as a foreign academician of the Chinese Academy of Engineering.

Professor Wang Zhengping is a Chair Professor of Electronic Engineering at the Chinese University of Hong Kong, Dean of the Faculty of Engineering, a Fellow of the U.S. National Academy of Engineering, and a Foreign Academician of the Chinese Academy of Engineering. He has long been engaged in research on electronic packaging, and for his pioneering contributions to this field over several decades, he has been... IEEE Awarded the highest honor in the field of electronic packaging. — IEEE Component, Packaging, and Manufacturing Technology Award, and is hailed as “ The Father of Modern Semiconductor Packaging ” It has now gained widespread recognition within the industry.

Professor Wang is one of the pioneers in plastic encapsulation technology. 1977 In that year, he pioneered the use of silicone resin in gate-controlled diode switches at Bell Labs. GDX ) Conducted encapsulation research and achieved the use of polymer materials to... GDX Sealed-equivalent packaging of the structure, significantly enhancing GDX Its encapsulation boasts high reliability while overcoming the drawbacks of traditional ceramic packaging, such as heavy weight, complex manufacturing processes, and high costs. The plastic encapsulation material and structural process have been approved by the U.S. military. 883 Reliability testing standards. This encapsulation technology has been successively adopted by... AT&T (American Telephone and Telegraph Company), used by the U.S. military, and subsequently transferred to Intel 、 IBM Once consumer electronics manufacturers adopt it and promote it widely throughout the industry, plastic packaging will currently account for a significant share of the global integrated circuit packaging market. 95% The above.

Professor Wang also conducted in-depth research and successfully addressed the long-standing issue of unstable contact resistance at the interface between conductive adhesives and devices—a problem that has long plagued the packaging industry. This innovative conductive adhesive technology is... Henkel ( Han Gao ) It has been used in conductive adhesive products by various companies ever since. At the same time, he pioneered the industry’s first solvent-free, high-… Tg The non-flow bottom-fill adhesive simplifies the flip-chip packaging process and improves the yield and reliability of devices. This non-flow bottom-fill adhesive technology is... Hitachi (Hitachi) and other companies have been using it for a long time. Since then, he has also led his research group in developing a silicon-based carbon nanotube array transfer technology, which... 3D It has laid a solid foundation in fields such as interconnects and nanoelectronic devices.

The main international awards received include: IEEE Component, Packaging, and Manufacturing Technology Award 2006 year), the Pan Wen-yuan Award (Taiwan’s highest honor for overseas Chinese in the field of electronic manufacturing technology, 2007 year), Dresden – The Barkhausen Prize (awarded by the German Materials Research and Testing Institute in Dresden, recognizing scientists worldwide who have made the most significant contributions to the fields of materials science, physics, and electronics) 2012 year), IEEE-CPMT (Innovation in Components, Packaging, and Manufacturing Technologies) Society Award for Outstanding Technical Achievement, IEEE-CPMT David – Feldman Outstanding Contribution Award, and others.

Professor Wang Zhengping, a renowned scholar in the field of international electronic packaging, has spent decades traveling between China and the United States, making significant contributions to China’s academic and industrial development as well as to international cooperation in scientific research and higher education.

For many years, he has consistently attended international conferences on electronic packaging held in China and delivered invited keynote speeches and short training courses, bringing cutting-edge international electronic packaging technologies back to China and thereby promoting the development of both the academic and industrial communities in China’s electronic packaging field. He has spared no effort in nurturing Chinese overseas students; currently, the total number of such students he has mentored is— 30 More than a few. He also actively welcomes young teachers from the Chinese mainland and corporate engineers. 20 The remaining personnel will visit and study at the National Packaging Research Center at Georgia Institute of Technology in the United States, doing their utmost to build a robust talent pipeline for electronic packaging in China.

2010 In that year, Professor Wang returned to China full-time and was appointed Dean of the Faculty of Engineering at the Chinese University of Hong Kong. To address the invisible constraints posed by the shortage of engineering research talent in Hong Kong, he is currently working through... 5–6 These reform initiatives aim to enable the Chinese University of Hong Kong to produce high-end research talent in the engineering field over the next decade, thereby boosting the development of the high-tech industry in Hong Kong and across China.

2011 In that year, Professor Wang was appointed as the Chief Scientist in the field of electronic packaging materials at the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, where he led the establishment of a team and successfully secured its inclusion. “ Advanced electronic packaging materials ” Guangdong Province’s Innovative Research Team. The team is conducting comprehensive research on key materials for electronic packaging, establishing a demonstration platform for the development and commercialization of electronic packaging materials at an international standard. The team strives to change China’s current reliance on imports for high-end electronic materials and high-performance devices, and to further enhance and optimize China’s integrated circuit industry’s upstream, midstream, and downstream value chain.

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