Hua Jin and CanCore Semiconductor Join Forces to Develop Next-Generation SoC and SiP Solutions.

April 21, 2015, Shanghai, China—HuaJin Semiconductor Packaging Leading Technology R&D Center Co., Ltd. (hereinafter referred to as “HuaJin”), which focuses on the R&D and industrialization of advanced technologies for system-level packaging and integration, and CanCore Semiconductor (Shanghai) Co., Ltd. (hereinafter referred to as “CanCore Semiconductor”), an internationally leading ASIC design company and one-stop service provider, have officially signed a technology cooperation agreement on SoC and SiP technologies. The two parties will collaborate on high-performance flip-chip ball grid array (FCBGA) and high-density three-dimensional system-level packaging (3D—

2015 Year 4 Moon 21 Japan-China Shanghai ——— HuaJin Semiconductor Packaging Leading Technology R&D Center Co., Ltd. (hereinafter referred to as “HuaJin”), which focuses on the R&D and industrialization of advanced technologies for system-level packaging and integration, and an internationally leading... ASIC Design company and one-stop service provider CanCore Semiconductor (Shanghai) Co., Ltd. (hereinafter referred to as... “ Chanzin Semiconductor”), officially signed System on Chip and System in Package Technical Cooperation Agreement. The two parties will collaborate on high-performance flip-chip ball grid arrays. Flip Chip Ball Grid Array (FCBGA) and high-density three-dimensional system-level packaging ( 3D-SiP, Including TSV ) and other innovative system-level packaging solutions to engage in comprehensive collaboration, aiming to achieve close integration across chip design, package design and simulation, and advanced process development, as well as... IC Co-design and holistic optimization in collaboration with the packaged system to deliver the most competitive products for end customers, achieving win-win outcomes for all parties involved.

Dr. Zhi Chunxing, President and CEO of CanCore Semiconductor, stated that, with the rapid development of the integrated circuit industry in recent years, CanCore Semiconductor needs to provide customers with chips that offer higher performance and faster speeds. In addition to CanCore Semiconductor’s own design expertise in advanced process technologies, it is equally important to collaborate with cutting-edge R&D centers like HuaJin to better serve our customers. SERDES ， PCIe High-speed packaging design and adoption TSV Technological 2. 5D/3D System-level packaging solution. To meet the needs of system companies and design firms, China’s supply chain is becoming increasingly closely linked with the international semiconductor industry. ， The joint R&D model between Hua Jin and CanCore Semiconductor is the general trend.

Hua Jin CEO Dr. Shangguan Dongkai stated that we have a complete... 12 Inch (Compatible) 8 Inch) TSV Process and WLP Our process R&D and pilot production line offers end-to-end services—from system packaging design and simulation, through process development, to rapid prototyping, pilot production and testing, and finally mass-production transfer. “ Post-Moore Era ” The arrival of [something] has placed higher demands on semiconductor packaging technology. We need to collaborate with technology leaders like CanCore Semiconductor. IC The design company achieves value for end customers and drives technological upgrades in the packaging and testing industry through collaborative innovation across industries.

About Hua Jin

Hua Jin Semiconductor Packaging Leading Technology R&D Center Co., Ltd. Located Located in the New District of Wuxi, Jiangsu Province, the company focuses on the R&D and industrialization of advanced technologies for system-level packaging and integration. The company’s research areas include: 2. 5D/3D Through-Silicon Via (TSV) Interconnection and integration key technologies, wafer-level high-density packaging technology, System in Package We conduct validation, improvement, and R&D on product applications as well as materials and equipment related to packaging technologies, providing systematic solutions for the industry. Our R&D platform includes an advanced packaging design simulation platform, among others. 2200 Purification rooms in square meters and 300mm ( Compatible 200mm) Wafer-level advanced packaging R&D platform (including 2. 5D/3DIC Backend processes and micro-assembly, packaging substrate lines, testing laboratories, and reliability & failure analysis platforms. The company provides the industry with a comprehensive suite of services—from system-level package design simulation and process development to rapid prototyping, pilot production and testing, and volume production transfer. For more details, please refer to HuaJin’s website. www.ncap-cn.com Or follow our WeChat official account. NCAP-CN 。

About CanCore Semiconductor

CanXin Semiconductor (Shanghai) Co., Ltd. is an internationally leading... ASIC Design service company providing customers with ultra-large-scale solutions. ASIC/SoC Chip design and manufacturing services. CanCore Semiconductor was co-founded by SMIC (Semiconductor Manufacturing International Corporation) and venture capital firms from both overseas and China. As CanCore Semiconductor’s strategic partner, SMIC provides robust technical support and tape-out guarantees to CanCore Semiconductor. Positioned as... 90nm/65nm/40nm/28nm and more high-end System on Chip Design Services: CanCore Semiconductor provides customers with a one-stop service—from source code or netlists to finished chips—and is committed to addressing customers’ complex... ASIC The design offers a complete, low-cost, and low-risk chip solution. For more details, please refer to the CanCore Semiconductor website. www.britesemi.com 。

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