The Advanced Institute has made new progress in research on thermal management of electronic packaging materials.

Recently, the Guangdong Province Innovative Research Team for Advanced Electronic Packaging Materials, led by Academician Zhengping Wang and Researcher Rong Sun from the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, has achieved a new breakthrough in thermal management of electronic packaging materials. The related paper, “Ice-Templated Assembly Strategy to Construct 3D Boron Nitride Nanosheet Networks in Polymer Composites for Thermal Conductivity Improvement,” has been published online.

Recently, the Guangdong Province Innovative Research Team for Advanced Electronic Packaging Materials, led by Academician Wang Zhengping and Researcher Sun Rong from the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, has achieved a new breakthrough in thermal management for electronic packaging materials. . Relevant paper Ice-Templated Assembly Strategy to Construct 3D Boron Nitride Nanosheet Networks in Polymer Composites for Thermal Conductivity Improvement Published online in a leading journal in the field of materials. Small Up ( DOI: 10.1002/smll.201502173 ).

With the rapid development of electronic technology, the power and integration levels of electronic devices are steadily increasing. Since... 1959 Since then, the feature size of devices has been continuously shrinking, evolving from the micrometer scale to the nanometer scale, while integration density has been increasing annually by... 40 To 50% The rate of increase is extremely high. In electronic devices, a significant portion of power loss is converted into heat. This heat dissipation in electronic devices directly leads to an increase in the temperature of electronic equipment and an escalation of thermal stress, posing a serious threat to the operational reliability and service life of these devices. Consequently, thermal management in electronic packaging has attracted widespread attention from both the scientific community and industry.

Addressing the issue of poor thermal conductivity in conventional polymer-based electronic packaging materials, the team employed directional freezing technology to achieve oriented alignment of thermally conductive fillers, thereby constructing a three-dimensional thermal-conducting network and ultimately developing a new-structure, highly thermally conductive electronic packaging material. Compared to traditional methods in which particles are randomly dispersed within the polymer matrix, the electronic packaging material prepared by this approach—thanks to the established three-dimensional thermal-conducting network—requires only a minimal amount of filler to enable free phonon transport in three-dimensional space, thus significantly enhancing the material’s thermal conductivity. This research achievement provides a novel approach for thermal management in high-performance electronic packaging materials and holds great potential for practical applications.

This research was funded by the Guangdong Province “Advanced Electronic Packaging Materials” Innovative Research Team and the Shenzhen “Advanced Electronic Packaging Materials” Peacock Team.

Design Concept for Constructing a Three-Dimensional Thermal Conductive Network in Mechanisms

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