The Shanghai Xinyang “R&D and Industrialization of Ultra-Pure Electroplating Solutions and Additives for Copper Interconnects in 65-45nm Chips” project has passed acceptance testing.

2015 Year 12 Moon 28 On the day, Shanghai Xinyang undertook... 65-45nm Research and Development and Industrialization of Ultra-High-Purity Electroplating Solutions and Additives for Chip Copper Interconnects ” The official acceptance meeting for the project was held at the company. This acceptance meeting was organized by the National Key Science and Technology Special Project. “ Special Project on Manufacturing Equipment and Complete Process Technologies for Ultra-Large-Scale Integrated Circuits ” (Abbreviated as 02 Specialized ” ) The Implementation Management Office convenes and organizes. 02 Ye Tianchun, leader of the special overall expert group and director of the Institute of Microelectronics at the Chinese Academy of Sciences, 02 Experts and leaders including Wang Ye, Director of the High-Tech Division of the Shanghai Municipal Science and Technology Commission and Director of the Special Implementation Management Office; Zheng Minzheng, former Deputy Director of the Electronic Information Products Department of the Ministry of Industry and Information Technology and Head of the Task Acceptance Expert Panel; Qin Liang, Deputy Director of the Shanghai Institute of Materials Research and Head of the Financial Acceptance Expert Panel; Professor Zhang Wei, Project Responsible Expert and Vice Dean of the School of Microelectronics at Fudan University; and Wu Zhenglong, Senior Manager at SMIC and representative of the user organization—along with representatives from the project undertaking units—attended the event. 50 Others also attended the meeting. Company leaders including Chairman Wang Fuxiang, Vice Chairman Sun Jiangyan, and General Manager Fang Shunong were present at the meeting.

The participating experts, in accordance with the "National Major Science and Technology Special Projects," “ Manufacturing Equipment and Complete Process for Ultra-Large-Scale Integrated Circuits ” The project acceptance was carried out in accordance with the relevant provisions of the "Interim Implementation Rules for Project Acceptance." The task acceptance experts listened to reports on the project’s completion status delivered by Sun Jiangyan, the project leader from Shanghai Xinyang, as well as by the project implementing units—Fudan University, Shanghai Jiao Tong University, and Shanghai Integrated Circuit R&D Center Co., Ltd. They also reviewed the test results and documentation submitted by the on-site testing team, examined the relevant acceptance documents, and conducted an on-site inspection. The financial experts, based on financial regulations including the "Interim Measures for the Management of Major Special Funds for Science and Technology under Civil Administration," compared the project budget with the relevant approval documents, reviewed the project audit reports, conducted spot checks of financial records, and performed on-site verification. After questioning and discussion, the experts unanimously agreed that the project had passed acceptance!

The meeting concluded that this project has completed the R&D tasks specified in the task contract and has developed a solution aimed at... 65-45nm Ultra-high-purity plating solution for advanced copper interconnects VMS ), TSV Electroplating solutions and ultra-high-purity electroplating additives for chip copper interconnects have been developed. 65-45nm Research on copper interconnect filling processes, fundamental studies on chip copper interconnect electroplating technologies and material performance, pilot-scale verification and evaluation of ultra-high-purity electroplating solutions and additives—each technical assessment indicator has met the requirements specified in the task contract. The project’s outcomes have been successfully scaled up for mass production and industrialized sales, and have undergone validation and assessment on multiple large-scale production lines. Among these, the chip copper interconnect electroplating solution has been adopted by SMIC Shanghai Co., Ltd. 8 Inch production line, SMIC Beijing Company 12 Inch 65-55nm The production line has been designated as a benchmark material. Baseline ), and in Wuxi SK Hynix 12 Inch 32nm The production line has achieved mass application! The project has applied for an invention patent in total. 61 Item, including domestic invention patents 56 Item: International Invention Patent PCT Application 5 item, and formulated 7 This is a corporate standard. The project has successfully established a production line for ultra-high-purity electroplating solutions and additives, and has met all the relevant performance indicators specified in the task contract!

Developed by Shanghai Xinyang for this project. “ Ultra-high-purity electroplating solutions and additives ” The technology is extremely challenging, and only a handful of suppliers worldwide are capable of commercializing it. Shanghai Xinyang’s early exploratory research in this field can be traced back to... 2004 Over the years, thanks to the relay efforts of two generations of technical talent at Xinyang, and after a long cycle of repeated research, failures, improvements, and further research, …… In 02 With the support of various parties, including Specialized and SMIC, the persistent team at Xinyang has finally... 2013 The year ushered in a dawn of success, and [it] was seen at SMIC and Wuxi. SK SK Hynix replaces foreign suppliers' plating solutions!

Heaven rewards those who work diligently, and our dreams will eventually come true—determined to keep climbing and strive for new heights! Today, we’ve achieved outstanding results and successfully completed... 65-45nm Research and Development and Industrialization of Ultra-High-Purity Electroplating Solutions and Additives for Chip Copper Interconnects ” Project. Tomorrow, we’ll go all out to complete the next R&D and industrialization task—without letting anyone down! 02 The special attention and high expectations that the Party and the state have placed on us!