The chemical mechanical planarization market will be worth $4.94 billion by 2020.

According to a new market research report on the “Chemical Mechanical Planarization Market by Type (Equipment & Consumables), Application (IC Manufacturing, MEMS & NEMS, Optics and Others), Technology (Leading Edge, More Than Moore’s),”

According to a new market research report on the “Chemical Mechanical Planarization Market by type (Equipment & consumables), Application (IC manufacturing, MEMS & NEM, Optics and Others), Technology (Leading edge, More Than Moore’s, and Emerging), and Geography (North America, Europe, APAC and RoW)” – Global Forecast to 2020 ″ , published by MarketsandMarkets, the market is expected to grow at a CAGR of 6.83% between 2015 and 2020, and reach $4.94 billion by 2020.

Chemical mechanical planarization is a critical process technology step in the semiconductor wafer fabrication process. In this process step, the top surface of the wafer is polished or planarized to create a flawless flat surface that is essential to make faster and more powerful semiconductor devices with the aid of chemical slurry & mechanical movements. The CMP tool is comprised of a rotating platen, slurry, pad, holding ring, brush, and pad conditioner. The mechanical element of this system applies downward pressure to a wafer surface, while the chemical reaction increases the material removal rate. The value chain of the CMP market consists of different players, including semiconductor material suppliers, CMP integrated solution providers, semiconductor wafer suppliers, semiconductor device manufacturers, slurry & pad manufacturers, technology solution providers, and CMP equipment manufacturers.

The global Chemical Mechanical Planarization Market was worth USD 3.32 Billion in 2014, and it is expected to reach USD 4.94 Billion by 2020, at an estimated CAGR of 6.83% from 2015 to 2020. Although the CMP market has reached a mature stage, it continues to evolve in response to the needs of end users. The industry is being compelled to adopt significant innovations in both process technologies and applications; as a result, various CMP processes have been developed to align with advancing technology nodes and emerging applications such as MEMS, advanced packaging, and advanced substrates. The growing demand for consumer electronic products, the increasing need for wafer planarization, and the rising use of micro-electro-mechanical systems (MEMS) are driving the global CMP market.

The CMP equipment market is expected to grow at the highest CAGR of 8.32% from 2015 to 2020. The key factors behind the high growth of the CMP equipment market are the strong growth in semiconductor equipment and capital spending. The CMP consumables market was valued at USD 2.25 billion in 2014 and is expected to reach USD 3.21 billion by 2020. Applied Materials, Inc. (U.S.) and Ebara Corporation (Japan) are the major CMP equipment suppliers for various integrated device manufacturers.

This CMP consumables market is dominated by major market players such as Cabot Microelectronics Corporation (U.S.), Fujimi Incorporated (Japan), and Dow Electronic Materials (U.S.).The CMP regional market is mainly dominated by Asia-Pacific, followed by North America and Europe. The Asia-Pacific region accounted for the largest market share of ~67% and is expected to grow at the highest CAGR of 7.40% during the forecast period, followed by North America. The countries in Asia-Pacific region such as Taiwan, South Korea, Japan, and China are investing more in semiconductor manufacturing to meet the increasing demand for consumer electronic products. This detailed market research study provides detailed qualitative and quantitative analysis of the global chemical mechanical planarization market. It provides a comprehensive review of major market drivers, restraints, opportunities, challenges, and key issues in the market.

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