Entegris Launches New Post-CMP Cleaning Solution

Entegris has launched a new post-chemical mechanical polishing (post-CMP) cleaning solution tailored for semiconductor manufacturing processes. The new PlanarCleanAG product series, designed specifically for processes below 10 nm, now joins Entegris’s industry-leading portfolio of post-CMP cleaning solutions. The CMP process used in silicon wafer fabrication involves a mechanical polishing step during which a chemical-mechanical polishing slurry is employed to remove excess conductive or dielectric materials from the surface of integrated components, achieving a smooth finish that enables the stacking of subsequent integrated circuit layers. The post-CMP cleaning step can effectively remove...

Entegris Introducing a new post-chemical mechanical polishing process suitable for semiconductor manufacturing. (post-CMP) Cleaning solution. New type PlanarClean AG The product series is specially designed for 10nm The following process, originally designed, is now being incorporated. Entegris Industry-leading post-CMP Among cleaning solutions.

Silicon wafer manufacturing CMP The process includes a mechanical polishing step, during which a chemical polishing solution formulation is used to remove excess conductive or dielectric materials from the surface of the integrated components, thereby achieving a smooth finish that allows for the stacking of other integrated circuit layers. post-CMP The cleaning steps can remove nanoparticles, minimizing the likelihood of wafer contamination while preserving the integrity of the materials in each layer.

In the cleaning steps for advanced-process manufacturing, the quantity and types of exposed films and materials change, further highlighting the necessity of specially formulated cleaning solutions. Moreover, changes in the abrasive particle composition have rendered many conventional... post-CMP Cleaning solutions prove to be inefficient or completely ineffective when used in advanced processes, especially in front-end processes. (FEOL) Most notably, these challenges have prompted semiconductor manufacturers to start opting for customized cleaning solutions, abandoning off-the-shelf commercial cleaning solutions.

PlanarClean AG The formulated solution meets these requirements, delivering outstanding one-step cleaning performance in advanced processes involving copper, cobalt, and tungsten, while also protecting underlying thin films and materials. The patented formulation helps enhance reliability and yield, achieve zero corrosion and zero contamination, extend processing wait times, and ultimately improve customer efficiency. Additionally, PlanarClean AG It can reduce the amount of chemicals required for cleaning steps, thereby offering advantages in holding costs; it also complies with the latest semiconductor fab chemical standards. EHS Safety requirements: The product has been evaluated by several leading wafer manufacturers and is now available for sale to all customers.

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