SMIC and Invensas Sign a DBI Technology Transfer and Licensing Agreement

SHANGHAI, China, and SAN JOSE, California, USA, March 15, 2017 /PRNewswire—“As a leading semiconductor foundry, SMIC provides advanced semiconductor manufacturing processes to electronic device manufacturers worldwide. We are delighted to add DBI technology to our technology portfolio,” said Dr. Qiu Ciyun, CEO and Executive Director of SMIC. “This technology represents a critical step in the fabrication of 3D-stacked image sensors. Through close collaboration with Invensas, we will help our customers accelerate the development and commercialization of next-generation imaging products.” DBI technology is a low-temperature hybrid wafer bonding process.

Shanghai, China and San Jose, California, USA 2017 Year 3 Moon 15 Daily electricity / PR Newswire “ As a leading semiconductor foundry, SMIC provides advanced semiconductor manufacturing processes to electronic device manufacturers worldwide. We are delighted to be able to... DBI Technology has been added to our technology portfolio. ” Dr. Qiu Ciyun, CEO and Executive Director of SMIC, stated that, “ This technology is... 3D The key steps in the fabrication of stacked image sensors, through collaboration with... Invensas Through close collaboration, we will accelerate the development and commercialization of next-generation imaging products for our customers. ”

DBI The technology is a low-temperature hybrid wafer bonding solution that enables bonding without applied pressure, now supporting special fine-pitch bonding of heterogeneous wafers. 3D Electronic interconnection. DBI 3D Interconnection can eliminate the need for... TSV The need to reduce size and lower costs, while also providing a pixel-level interconnect technology roadmap for the next-generation image sensors.

“ I’m delighted to have signed this licensing agreement with SMIC, one of the world’s largest and most prestigious semiconductor foundries. Invensas President Craig Mitchell Indicates, “ SMIC Approved DBI Given the immense significance of technology for global customers, we also look forward to collaborating even more closely with SMIC to integrate this platform into their world-class design and manufacturing environment. ”

So the mainland chooses. 3D NAND Start again, 3D The process technology also has the potential to be applied to other products, such as... 3D MRAM As for the economies of scale in R&D, given the corresponding production scale associated with the investment, if there is any surplus, there will be an opportunity to sustain ongoing independent R&D efforts.

Key words: