Xiamen Hengkun New Materials Technology Co., Ltd. has successfully listed on the STAR Market.

On November 18, 2025, Xiamen Hengkun New Materials Technology Co., Ltd. (stock abbreviation: Hengkun New Materials, stock code: 688727.SH) was successfully listed on the STAR Market of the Shanghai Stock Exchange.

On November 18, 2025, Xiamen Hengkun New Materials Technology Co., Ltd. (stock abbreviation: Hengkun New Materials; stock code: 688727.SH) was successfully listed on the STAR Market of the Shanghai Stock Exchange. As a company with R&D and mass-production capabilities for key materials—including photoresist materials and precursors used in the manufacturing of 12-inch integrated circuit wafers—Hengkun New Materials’ listing marks the beginning of a rapid growth phase for the company and will inject new momentum into strengthening, stabilizing, and solidifying the supply chain for integrated circuit materials.

Founded in 2004, Hengkun New Materials is headquartered in the Haicang District of Xiamen City. After more than 20 years of development, the company has become a key driving force for high-quality regional economic growth, thanks to its leading technological capabilities and consistently reliable product quality. Hengkun New Materials focuses on the R&D and industrialization of photolithography materials and precursor materials. To date, the company has independently developed and validated over 100 product varieties, with its customers including several top-tier 12-inch wafer fabs.

Hengkun New Materials is publicly issuing 67,397,940 shares this time, representing 15% of the total share capital after the issuance. The total funds raised amount to 1.01 billion yuan, which will be used for the second-phase precursor project for integrated circuits and the advanced materials project for integrated circuits.

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