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“Research and Industrialization of Sputtering Target Materials for 300mm Silicon Wafer Process” – the National Science and Techn

“Research and Industrialization of Sputtering Target Materials for 300mm Silicon Wafer Process” – the National Science and Techn

Source:
2014/09/01
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  The National Science and Technology Major Project of “Very Large Scale Integrated Circuit Manufacturing Equipment and Complete Process” (“National Science and Technology 02 Major Project”) – “Research and Industrialization of Sputtering Target Materials for 300mm Silicon Wafer Process” Project met the requirements of the contract in terms of all indicators jointly after 5 years of joint research in industry-college-institute cooperation. The project is accepted by National Science and Technology 02 Major Project Implementation Management Office on March 28. The completion of the project has broken the monopoly of the United States and Japan on high-end target materials for integrated circuits, and has played a major role in promoting the technological advancement of national electronic information products and the complete development of the entire industry chain of integrated circuits.