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All companies in the column are rated A class in preliminary -evaluation of suppliers and their products are applied in batch in production lines of 8-inch and above integrated circuits. 

Criteria of rating: The rating is made according to the evaluation grade of corporate suppliers, batch production and application scope in technical nodes and others. For more details, please contact the Secretariat. 

Copper / barrier layer chemical mechanical polishing fluid series

Product features: Copper polishing liquid: high grinding rate (0.5-1 μ M / min), high dilution ratio (> = 10x) barrier layer polishing liquid: high grinding rate (0.1 μ M / min), adjustable selection ratio



Anji Microelectronics (Shanghai) Co., Ltd

Silicon chemical mechanical polishing fluid series

Product features: rough polishing liquid: high grinding rate (1-2 μ M / min), high dilution ratio (1:20-1:40); fine polishing liquid: ultra-low surface defects, ultra-low surface roughness, high dilution ratio (1:10-1:20)



Anji Microelectronics (Shanghai) Co., Ltd

Silicon dioxide chemical mechanical polishing fluid series

Product features: a full range of silica particles selection (sintered and colloidal), defect enhancement



Anji Microelectronics (Shanghai) Co., Ltd

Ceria chemical mechanical polishing fluid series

Product features: high grinding rate (> 0.6 μ M / min), diluble (> = 4x), high o / N selection ratio (> = 150)



Anji Microelectronics (Shanghai) Co., Ltd

Tungsten chemical mechanical polishing fluid series

Product features: wide grinding speed range (0.2-1 μ M / min), high dilution ratio (> = 10x), low defects
Anji Microelectronics (Shanghai) Co., Ltd
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