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Sulfuric acid (H2SO4, 96% concentration)
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Sulfuric acid (H2SO4, 96% concentration)

It can be used to remove metal and organic matter on the surface of silicon wafer, and also can be used for wet etching and final degumming in photolithography. metal ion <50ppt,particle:0.5um<10、0.3um<20、0.2um<100。

Hubei Xingfu Electronic Materials Co., Ltd

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It can be used to remove metal and organic matter on the surface of silicon wafer, and also can be used for wet etching and final degumming in photolithography. metal ion <50ppt,particle:0.5um<10、0.3um<20、0.2um<100。

Hubei Xingfu Electronic Materials Co., Ltd

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暂未实现,敬请期待
暂未实现,敬请期待
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