Contact Us       中文

1

1

 
Search
>
>
>
>
Copper / barrier layer chemical mechanical polishing fluid series
Page view

Copper / barrier layer chemical mechanical polishing fluid series

Product features: Copper polishing liquid: high grinding rate (0.5-1 μ M / min), high dilution ratio (> = 10x) barrier layer polishing liquid: high grinding rate (0.1 μ M / min), adjustable selection ratio



Anji Microelectronics (Shanghai) Co., Ltd
没有此类产品
Detail
Product features: Copper polishing liquid: high grinding rate (0.5-1 μ M / min), high dilution ratio (> = 10x) barrier layer polishing liquid: high grinding rate (0.1 μ M / min), adjustable selection ratio
 
 
 
Anji Microelectronics (Shanghai) Co., Ltd
Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
Previous article
Next article