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Copper / barrier layer chemical mechanical polishing fluid series
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Copper / barrier layer chemical mechanical polishing fluid series

Product features: Copper polishing liquid: high grinding rate (0.5-1 μ M / min), high dilution ratio (> = 10x) barrier layer polishing liquid: high grinding rate (0.1 μ M / min), adjustable selection ratio



Anji Microelectronics (Shanghai) Co., Ltd
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Product features: Copper polishing liquid: high grinding rate (0.5-1 μ M / min), high dilution ratio (> = 10x) barrier layer polishing liquid: high grinding rate (0.1 μ M / min), adjustable selection ratio
 
 
 
Anji Microelectronics (Shanghai) Co., Ltd
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暂未实现,敬请期待
暂未实现,敬请期待
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