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2016 International Planarization Technology Conference (ICPT 2016) was successfully held for the first time in mainland China

2016 International Planarization Technology Conference (ICPT 2016) was successfully held for the first time in mainland China

Source:
2018/09/20
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The International Conferenceon Planarization/CMP Technology (ICPT) was successfully held at Beijing Friendship Hotel on October 17-19, 2016. ICPT is the largest and most attended international event in the field of flattening. It is held annually in six countries or regions including the United States, Europe, Japan, South Korea, Taiwan, and China. This year is the first time ICPT is in China. Hosted by the mainland. The conference was co-sponsored by China Flat Technology Alliance and Beijing Multidimensional Electronic Materials Technology Development and Promotion Center, IEEE Beijing Branch Technology and Publishing Support, China Semiconductor Industry Association, Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance, and China Machinery Co-organized by the Engineering Society Tribology Branch.
 
This conference is a grand meeting of international exchange of chemical mechanical polishing (CMP) and flattening technology. It is a grand meeting of cooperation and exchange between flat technology and industrial chain in micro-nano electronics and precision manufacturing. The chairman of the conference is Prof