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Organic/inorganic alternating structure film process and control for organic device packaging

Organic/inorganic alternating structure film process and control for organic device packaging

Source:
2015/07/23
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Keywords: organic electronic device package, PECVD, organic/inorganic alternating structure film, water oxygen barrier performance
 
Organic electronic devices have developed rapidly in recent years and are one of the highlights of the electronics industry in the 21st century. According to the market analysis report of the professional organization NanoMarkets, the future output value of the organic electronics industry will exceed 300 billion US dollars. Organic electronic devices are characterized by lightness, thinness, and softness. Organic electronic device packaging requires low temperature, flexible, thin film packaging. Alternating structural films are considered to be the most effective thin film encapsulation. There are many ways to prepare a film, but to meet the requirements of low temperature, high density and flexibility, only an organic/inorganic alternating film structure can be realized. Our group designed and built a set of ICP-PECVD system, which can realize the low-temperature growth of organic/inorganic alternating structure homologous and homogenous films (temperature below 120 degrees). Based on this equipment, we have conducted in-depth research on the growth of organic/inorganic alternating structure films, including: deposition temperature, RF power, process gas flow rate and ratio, deposition pressure and other parameters on the properties of single-layer inorganic or organic thin films, comprehensive research The influence of parameters such as alternating structure interface and number of alternating structure layers on water-oxygen barrier performance. The experimental results show that the inorganic film is the main barrier layer of water and oxygen molecules, and the organic film mainly increases the flexibility and stress of releasing the inorganic film. Moreover, the defects and compactness of the inorganic film have a great influence on the water-oxygen barrier properties of the entire package structure, and the interface characteristics of the alternating structure have an important influence on the water-oxygen barrier performance. The single-cycle organic/inorganic alternating structure has an oxygen barrier of 10-2 g/m2·day, and the four-cycle organic/inorganic alternating structure has an oxygen barrier of 10-5 g/m2·day.