New Product Launch Conference of Hubei Dinglong Holdings Co.,Ltd. was held in Wuhan on November 26, 2021. Dinglong's subsidiary Wuhan Roxian Technology Co., Ltd., Hubei Dinghui Microelectronics Material Co., Ltd., Wuhan Dingze New Material Technology Co., Ltd., and the joint unit Wuhan Dinglong Huida Material Technology Co., Ltd. released a variety of new products, including semiconductors CMP process uses polishing pads, polishing fluids, cleaning fluids, dressing discs, nano-abrasive particles, and 24 key materials such as polyimide for OLED display, photosensitive polyimide, packaging ink, and low-temperature photoresist materials.