Project

Cooperative Development of Localized Mass Production of Advanced Packaging Underfill materials

Company

NCAP CHINA

DARBOND

JCET

Project

Quality Improvement of Domestic Silicon Epitaxial Materials

Company

CR MICRO

NANJING GUOSHENG

Project

R&D and Industrial Application of Domestic Medium and High-end Epoxy Plastic Packaging Materials for IC

Company

TSHT

HHCK

Project

Localization of Temporary Bonding Materials for High-Density Fan-out Packaging

Company

SEMCIEN

SIEM

SMEC

Project

Mass Production Application of High-Proportion Germane-Hydrogen Mixture in Advanced Logic SiGe Process

Company

SPECTRUM

HLMC