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2020 Statistical Report on Special Packaging Materials Industry Data

2020 Statistical Report on Special Packaging Materials Industry Data

Source:
2021/06/17
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This report is based on the requirements of the Chinese market and uses 2020 data to analyze China`s special packaging material industry in terms of industrial scale, product production capacity, R & D and industrial development investment, patents, and employees. The report was completed in June 2021.

Table of Contents
1 The overall industrial scale of semiconductor packaging materials in China 1
2 China's R&D investment in semiconductor packaging materials industry 3
3 China's investment in the industry development of semiconductor packaging materials industry 4
4 Patents in China's semiconductor packaging materials industry 5
5 Employees in the semiconductor packaging materials industry in China 6
6 Analysis of the maturity of China's special packaging materials industry 8

Chart Catalog
Figure 1 2010-2021 Special packaging materials industry company sales revenue growth and forecast 2
Figure 2 2010-2021 Sales revenue growth and forecast for semiconductor packaging products 2
Figure 3 The proportion of semiconductor packaging materials used in total product sales revenue from 2010 to 2021 3
Figure 4 The growth of R&D investment in the special packaging materials industry from 2010 to 2020 4
Figure 5 The growth of investment in the industry development of the special packaging materials industry from 2010 to 2020 5
Figure 6 The growth of the number of patents in the special packaging material industry from 2010 to 2020 6
Figure 7 The composition of personnel in the special packaging materials industry in 2020 (according to academic qualifications) 7
Figure 8 The composition of personnel in the special packaging materials industry in 2020 (according to the nature of work) 7
Figure 9 Lead frame product maturity in 2020 8
Figure 10 Maturity of bonding wire products in 2020 9
Figure 11 Maturity of epoxy molding compound products in 2020 9
Figure 12 Maturity of die-bonding material products in 2020 10
Figure 13 Product maturity of underfill materials in 2020 10
Figure 14 Product maturity of thermal interface materials in 2020 11
Figure 15 The maturity of solder ball products in 2020 11
Figure 16 Flux product maturity in 2020 12
Table 1 2010-2021 Special packaging materials industry company sales revenue growth and forecast 1
Table 2 2010-2021 Sales revenue growth and forecast for semiconductor packaging products 2
Table 3 The proportion of semiconductor packaging materials used in total product sales revenue from 2010 to 2021 3
Table 4 Development trend of R&D investment in special packaging materials industry from 2010 to 2020 4
Table 5 2010-2020 Industry development investment development trend of special packaging industry 4
Table 6 2010-2020 Development trend of patent number in special packaging industry 5
Table 7 Personnel composition of special packaging materials industry in 2020 6